Electronic device including connector

ABSTRACT

An electronic device is provided. The electronic device includes a circuit board including multiple lands arranged on a surface, and an electrical receptacle including multiple contacts electrically connected to the multiple lands, the electrical receptacle being installed on the circuit board, where at least two contacts are connected to at least one land among the multiple lands.

PRIORITY

This application claims priority under 35 U.S.C. § 119(a) to KoreanPatent Application No. 10-2015-0071975, which was filed in the KoreanIntellectual Property Office on May 22, 2015, the entire content ofwhich is incorporated herein by reference.

BACKGROUND

1. Field of the Disclosure

The present disclosure relates generally to an electronic deviceincluding a connector, which electrically connects between electricelements.

2. Description of the Related Art

In general, kinds of interfaces (e.g., ports or cables), which are usedto connect computers with peripheral devices, have been highlydiversified, and so too have been methods for connecting and using them.Therefore, it is often difficult for those without professionalknowledge of computers to connect peripheral devices to computers. Inparticular, many users find it difficult to know what cable is to beplugged into what port when a specific peripheral device is to beconnected to the computer; and then to determine what settings should bemade, after connection, for operation of the device.

This poses problems not only for users, but also for manufacturers ofcomputers and peripheral devices alike. This is because, if variousperipheral devices use different specifications of communicationschemes, it is often confusing to determine what interfaces a computershould be provided with, and to determine what interface a peripheraldevice is to be designed with.

Such a problem would be substantially solved if all computer peripheraldevices use the same standard of interface, and if they become ready touse as soon as they are connected to the computer, without anyseparation operation. Furthermore, convenience would be multiplied if aconnected peripheral device could operate on its own, i.e. withoutconnecting to a separate external power supply.

Universal Serial Bus (USB) communication has appeared as a standardinterface in order to solve the above problem. The most noticeablefeature of USB communication is convenience. It supports a plug-and-playfunction so that, when a peripheral device is plugged in, the computerinstantly recognizes its connection. However, some USB communicationdevices may require additional software installation. In addition, whilemost other types of interfaces require that the computer be powered offbefore connecting a device, USB communication supports a hot swappingfunction so that a peripheral device can be connected, disconnected, orexchanged even when the computer is powered on. The USB communication isalso characterized by a feature which uses the port of the computer tosupply power to peripheral devices on its own. Among USB communicationspecification products, small devices such as mice, keyboards, andexternal hard disks mostly operate with no connection to a separatepower supply, and there are even large devices, such as printers andscanners, that can operate with no separate power supply. Furthermore,such characteristics of USB communication can also be used to chargemobile devices such as mobile phones and MP3 players. Thanks to theabove-mentioned advantages, there are various computer peripheraldevices developed according to the USB communication specifications,such as mice, keyboards, printers, scanners, and webcams.

Currently, continued development of electronic communication industrieshas made user devices, such as mobile communication terminals (cellularphones), electronic organizers, and personal complex terminals,indispensable products in modern societies. Such user devices havebecome capable of providing not only voice communication services, butalso various data transmission services and diversified additionalservices, changing into multimedia communication devices in terms oftheir functions.

Such user devices include antennas for wireless communication. Suchantennas tend to evolve into embedded antennas, which are equippedinside user devices. For example, an antenna is implemented as aconductive pattern on a circuit board. Electronic components for variousfunctions are installed on a circuit board, and there are efforts toreduce the size of such electronic components; however, there are stilldifficulties in securing an area on the circuit board, in which aconductive pattern is to be installed for an antenna.

SUMMARY

The present disclosure has been made to address at least the problemsand disadvantages described above, and to provide at least theadvantages described below.

Accordingly, an aspect of the present disclosure is to provide anelectronic device including a connector, which is configured such thatthe area occupied by electronic components on a circuit board isreduced, thereby securing an area for installing an antenna.

According to an embodiment of the present disclosure, the size of theconnector can be reduced, thereby securing an area for antennainstallation on the circuit board, and improving the performance of theantenna.

In accordance with an aspect of the present disclosure, an electronicdevice is provided. The electronic device includes a circuit boardincluding multiple lands arranged on a surface, and an electricalreceptacle including multiple contacts electrically connected to themultiple lands, the electrical receptacle being installed on the circuitboard. at the at least two contacts are connected to at least one landamong the multiple lands.

In accordance with another aspect of the present disclosure, anelectronic device is provided. The electronic device includes a circuitboard including multiple lands arranged on a surface in one row, and anelectrical receptacle including multiple contacts electrically connectedto the multiple lands, the electrical receptacle being installed on thecircuit board. The electrical receptacle includes only multiple contactscorresponding to a communication specification of a lower versionsupported by the electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more apparent from the following detailed descriptiontaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates connectors, according to an embodiment of the presentdisclosure;

FIG. 2 illustrates a receptacle tongue and multiple receptacle contactsof a receptacle tongue, according to an embodiment of the presentdisclosure;

FIG. 3 schematically illustrates an arrangement of multiple receptaclecontacts in connection with a receptacle tongue, according to anembodiment of the present disclosure;

FIG. 4 illustrates coupling between a receptacle and a circuit board,according to an embodiment of the present disclosure;

FIG. 5 illustrates coupling between a receptacle and a circuit board,according to another embodiment of the present disclosure;

FIG. 6A illustrates a coupling state between a receptacle and a circuitboard, according to an embodiment of the present disclosure;

FIG. 6B illustrates a coupling state between a receptacle and a circuitboard with parts of a receptacle shell removed, in order to illustratemultiple receptacle contacts, according to an embodiment of the presentdisclosure;

FIG. 6C illustrates a part of a coupling state between a receptacle anda circuit board, according to an embodiment of the present disclosure;

FIG. 7A illustrates a coupling state between a receptacle and a circuitboard according to the prior art;

FIG. 7B illustrates a coupling state between a receptacle and a circuitboard according to the prior art, with parts of a receptacle shellremoved;

FIG. 7C illustrates a part of a coupling state between a receptacle anda circuit board according to the prior art;

FIG. 7D illustrates a mid-plate and multiple receptacle contacts of areceptacle according to the prior art;

FIG. 8 is a diagram comparing a coupling state between multiplereceptacle contacts and a circuit board, according to the prior art, anda coupling state between multiple receptacle contacts and a circuitboard, according to an embodiment of the present disclosure;

FIG. 9 illustrates a coupling state between multiple receptacle contactsand a circuit board, according to an embodiment of the presentdisclosure;

FIG. 10 illustrates a part of a receptacle, according to an embodimentof the present disclosure;

FIG. 11 illustrates a coupling state between multiple receptaclecontacts and a circuit board, according to an embodiment of the presentdisclosure;

FIG. 12 is a partial sectional view of a receptacle, according to anembodiment of the present disclosure;

FIG. 13 and FIG. 14 illustrate parts of a receptacle, according to anembodiment of the present disclosure;

FIG. 15 illustrates an arrangement of solder tails of multiplereceptacles, which are adjacent to each other, according to anembodiment of the present disclosure;

FIG. 16 illustrates an arrangement of multiple first contact sectionsarranged on a free end portion of a receptacle tongue in connection withmultiple receptacle contacts, and an arrangement of solder pads on acircuit board, on which solder tails of multiple second contact sectionsextending from the multiple first contact sections are to be installed,according to an embodiment of the present disclosure;

FIG. 17 illustrates changing an order of arrangement of solder pads on acircuit board, according to an embodiment of the present disclosure;

FIG. 18 illustrates an arrangement of solder pads on a circuit board, onwhich solder tails of multiple second contact sections are to beinstalled, in connection with receptacle contacts, according to anembodiment of the present disclosure;

FIG. 19 illustrates an arrangement of multiple first contact sectionsarranged on a free end portion of a receptacle tongue in connection withmultiple receptacle contacts, and an arrangement of solder pads on acircuit board, on which solder tails of multiple second contact sectionsextending from the multiple first contact sections are to be installed,according to an embodiment of the present disclosure;

FIG. 20 is a perspective view of an electronic device, according to anembodiment of the present disclosure;

FIG. 21 is a perspective view of an electronic device viewed in variousdirections, according to an embodiment of the present disclosure;

FIG. 22 is a sectional view of an electronic device, according to anembodiment of the present disclosure;

FIG. 23 illustrates an electronic device in a disassembled state,according to an embodiment of the present disclosure;

FIG. 24A illustrates a receptacle and a circuit board, according to anembodiment of the present disclosure;

FIG. 24B is a diagram comparing an antenna installation area inconnection with a circuit board, according to the prior art, and anantenna installation area in connection with a circuit board, accordingto an embodiment of the present disclosure; and

FIG. 25 is a block diagram of an electronic device, according to variousembodiments.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE PRESENT DISCLOSURE

Various embodiments of the present disclosure will be described hereinwith reference to the accompanying drawings, in which like referencenumbers are used to depict the same or similar elements, features, andstructures. Various modifications and changes to the embodiments of thepresent invention may be made without departing from the scope andspirit of the present disclosure. Specific embodiments are illustratedin the drawings and a related detailed description is made. However, theembodiments described herein are not intended to limit the presentdisclosure to a specific embodiment form, and should be understood asincluding all modifications and/or equivalents or alternatives includedin the spirit and technological scope of the present disclosure.

The expressions “comprise” and “may comprise” as used herein indicatethe existence of disclosed corresponding functions, operations, orconstituent elements, etc. and do not limit additional functions,operations, or constituent elements, etc. Also, the terms “comprise” and“have”, should be understood as being intended to designate theexistence of features stated in the specification, numerals, steps,operations, constituent elements, components or a combination of them,and not previously excluding the possibility of the existence oraddition of one or more other features, numerals, steps, operations,constituent elements, components or combinations of them.

As used herein, the expression “or” includes any and all combinations ofwords enumerated together. For example, “A or B” may include A, or mayinclude B, or may include A and B.

The expressions “1st”, “2nd”, “first” or “second”, etc. as used hereinmay modify various constituent elements, but are not intended to limitcorresponding constituent elements. For example, the expressions do notlimit the order and/or importance of the corresponding constituentelements. The expressions may be used to distinguish one constituentelement from another constituent element. For example, both of a firstuser device and a second user device are user devices, and representuser devices different from one another. For example, a firstconstituent element may be referred to as a second constituent elementwithout departing from the scope of the present disclosure. Likewise, asecond constituent element may be referred to as a first constituentelement.

When it is mentioned that a constituent element is “connected” to or“accessed” by another constituent element, it should be understood thatthe first constituent element may not only be directly connected to oraccessed by the second constituent element, but also a new thirdconstituent element may exist between the first constituent element andthe second constituent element. On the other hand, when it is mentionedthat a constituent element is “directly connected” to or “directlyaccessed” by another constituent element, it should be understood thatno third constituent element exists between the first constituentelement and the second constituent element.

The terms used herein are used merely to explain specific embodiments ofthe present disclosure, and are not intended to limit the variousembodiments of the present disclosure.

An expression of singular number includes the expression of pluralnumber unless the context clearly dictates otherwise.

Unless defined otherwise, all terms used herein, including technologicalor scientific terms, have the same meaning as those commonly understoodby a person having ordinary knowledge in the art to which the presentdisclosure belongs. Terms as defined in a general dictionary should beinterpreted as having meanings consistent with the contextual meaningsof a related technology, and should not be interpreted as ideal orexcessively formal meanings unless explicitly defined herein.

An electronic device, according to various embodiments of the presentdisclosure, may be a device including a display function. For example,the electronic device may include at least one of a smart phone, atablet Personal Computer (PC), a mobile phone, a video phone, anelectronic book (e-book) reader, a desktop PC, a laptop PC, a netbookcomputer, a Personal Digital Assistant (PDA), a Portable MultimediaPlayer (PMP), an MPEG Audio Layer 3 (MP3) player, a mobile medicalinstrument, a camera, or a wearable device (e.g., a Head-Mounted Device(HMD) such as electronic glasses, electronic clothes, an electronicbracelet, an electronic necklace, an electronic appcessory, anelectronic tattoo, or a smart watch).

According to some embodiments, the electronic device may be a smart homeappliance having a display function. The smart home appliance, forexample, the electronic device may include at least one of a television,a Digital Video Disk (DVD) player, an audio system, a refrigerator, anair conditioner, a cleaner, an oven, a microwave, a washing machine, anair cleaner, a set-top box, a TV box (for example, Samsung HomeSync™,Apple TV™, or Google TV™), a game console, an electronic dictionary, anelectronic locking system, a camcorder, or an electronic picture frame.

According to some embodiments, the electronic device may include atleast one of various medical instruments (e.g., Magnetic ResonanceAngiography (MRA) machine, Magnetic Resonance Imaging (MRI) machine,Computerized Tomography (CT) machine, a moving camera, an ultrasonicmachine, etc.), a navigation device, a Global Positioning System (GPS)receiver, an Event Data Recorder (EDR), a Flight Data Recorder (FDR), acar infotainment device, an electronic equipment for ship (e.g., anavigation device for a ship and a gyrocompass, etc.), avionics, asecurity instrument, a head unit for vehicles, an industrial or homeservice robot, an Automatic Teller's Machine (ATM), or a Point Of Sales(POS) machine.

According to some embodiments, the electronic device may include atleast one of a part of furniture or building/structure including adisplay function, an electronic board, an electronic signature receivingdevice, a projector, or various metering instruments (e.g., tap water,electricity, gas, or radio wave metering instrument, etc.).

The electronic device according to various embodiments of the presentdisclosure may be one of the aforementioned various devices or acombination of two or more of them. Also, the electronic deviceaccording to various embodiments of the present disclosure may be aflexible device. Also, the electronic device according to variousembodiments of the present disclosure is not limited to theaforementioned instruments.

The term ‘user’ used herein may denote a person who uses the electronicdevice or a device (e.g., an artificial-intelligence electronic device)which uses the electronic device.

FIG. 1 illustrates connectors, according to an embodiment of the presentdisclosure. FIG. 2 illustrates a receptacle tongue and multiplereceptacle contacts of a receptacle, according to an embodiment of thepresent disclosure.

Referring to FIGS. 1 and 2, the connectors may include a receptacle 100and a plug 2110.

The receptacle 100 is an element that can be electrically connected tothe plug 2100. The receptacle 100 includes a receptacle shell 110, areceptacle tongue 120, and multiple receptacle contacts 130-N.

The receptacle shell 110 approximates the shape of a container includinga passage 110-P, through which the plug 2100 can be inserted. Thereceptacle shell 110 includes an opening 110-O, which becomes anentry/exit of the passage 110-P, and the plug 2100 can be moved into thepassage 110-P of the receptacle shell 110 via the opening 110-O. Whenviewed from the cross-section, the opening 110-O has a width larger thanthat of the passage 110-P and facilitates insertion of the plug 2100into the passage 110-P.

The passage 110-P of the receptacle shell 110 extends straight, and theplug 2100 may be guided by the passage 110-P of the receptacle shell 110and inserted into the receptacle 100.

When viewed from the cross-section, the passage 110-P of the receptacleshell 110 may include an upper passage 110-PU, a low passage 110-PD, aleft passage 110-PL, and a right passage 110-PR that encloses a free endportion 120-1 of the a receptacle tongue 120. The upper passage 110-PUand the lower passage 110-PD are opposite from one another, and aresymmetrical. The left passage 110-PL and the right passage 110-PR areopposite from one another, and are symmetrical.

The plug 2100 includes a plug shell 2110 that may be inserted into thepassage 110-P of the receptacle shell 110 without distinction of up ordown. The plug shell 2100 includes a passage 2100-P in which the freeend portion 120-1 of the receptacle tongue 120 is inserted when the plug2100 and the receptacle 100 are coupled with each other.

The receptacle shell 110 may be molded using a non-conductive materialor a conductive material. Particularly, the receptacle shell 110 may bemolded using a conductive material (for example, stainless steel orphosphor bronze), electrically connected to a circuit board (or PrintedCircuit Board (PCB)), and used as a ground return path. The groundreturn path can improve Electro Magnetic Compatibility (EMC).

The receptacle shell 110 may further include a spring portion shaped toprotrude into the passage (110-P). In this case, when the plug 2100 isintroduced into the passage 100-P of the receptacle 100, the springportion may undergo deformation of elastic bending so as to elasticallypressurize the surface of the plug shell 2110 of the plug 2100. Themetallic receptacle shell 110 and the metallic plug shell 2110 may beelectrically connected via the spring portion.

The receptacle shell 110 includes multiple leads 110-L1 and 110-L2shaped to protrude to the outside of the passage (110-P). The multipleleads 110-L1 and 110-L2 are used to couple the receptacle 100 to thecircuit board. At least one lead 110-L1 may be shaped such that itextends in the horizontal direction (for example, x-axis direction) froma side portion of the receptacle shell 110 and then bends in thevertical direction (z-axis direction). Alternatively, at least one lead110-L2 may extend from the bottom of the receptacle shell 110 in thevertical direction (z-axis direction).

The receptacle tongue 120 includes a fixed portion 120-2, which is fixedto the receptacle shell 110, and a free end portion 120-1, which extendsfrom the fixed portion 120-2 and is arranged inside the passage 110-P ofthe receptacle shell 110.

When viewed in cross-section, the free end portion 120-1 of thereceptacle tongue 120 is shaped to approximately have upper/lower andleft/right symmetry. For example, the free end portion 120-1 of thereceptacle tongue 120 may have the shape of a plate having apredetermined thickness, and may extend in the direction (y-axisdirection) of the passage 110-P of the receptacle shell 110.

The free end portion 120-1 of the receptacle tongue 120 is arranged soas not to contact the inner surface of the passage 110-P of thereceptacle shell 110. The passage 110-P of the receptacle shell 110 isdivided into an upper passage 110-PU and a lower passage 110-PD withreference to the free end portion 120-1 of the receptacle tongue 120.

The receptacle tongue 120 includes a base plate 120-10 molded using anon-conductive material (for example, glass-filled nylon) and amid-plate 120-20 arranged inside the base plate 120-10. The base plate120-10 may be molded using a conductive material (such as stainlesssteel), and is used as a part on which multiple receptacle contacts130-N (described later) are arranged. In addition, the mid-plate 120-20may be electrically connected to the circuit board and used as a groundreturn path. Furthermore, the mid-plate 120-20 protrudes (P) to thefront of the receptacle tongue 120, and prevents the receptacle tongue120 from being damaged by an erroneous insertion of an unwanted objectinto the receptacle 100.

The multiple receptacle contacts 130-N include multiple first contactsections 130-1S arranged on at least one surface of the receptacletongue 120. The multiple first contact sections 130-1S extend in thedirection of insertion IN of the plug 2100. When the plug 2100 isinserted into the receptacle 100, the multiple first contact sections130-1S are electrically connected to multiple plug contacts 2130-N ofthe plug 2100.

The multiple first contact sections 130-1S may include a spring portionhaving a bent shape. In this case, when the plug 2100 is introduced intothe passage 110-P of the receptacle 100, the spring portion may undergodeformation of elastic bending so as to elastically pressurize themultiple plug contacts 2130-N of the plug 2100.

The multiple first contact sections 130-1S may be divided and arrangedon the upper surface 120-1S1 and the lower surface 120-1S2, which faceeach other, of the free end portion 120-1 of the receptacle tongue 120.In this configuration, the upper surface 120-1S1 of the free end portion120-1 of the receptacle tongue 120 limits the upper passage 110-PU. Andthe lower surface 120-1S2 of the free end portion 120-1 of thereceptacle tongue 120 limits the lower passage 110-PD.

The number of multiple upper first contact sections 130-1SU arranged onthe upper surface 120-1S1 of the free end portion 120-1 of thereceptacle tongue 120 may be equal to or different from the number ofmultiple lower first contact sections 130-1SD arranged on the lowersurface 120-1S2 of the free end portion 120-1 of the receptacle tongue120.

At least one of the multiple upper first contact sections 130-1SU may beused for the same function (for example, ground return path, data signaltransfer, power signal transfer, etc.) as that of at least one of themultiple lower first contact sections 130-1SD.

The plug 2100 may include a multiple plug contacts 2130-N disposed onthe passage 2110-P. For example, the passage 2100-P may include a firstsurface 2110-S1 in a first direction, and a second surface 2110-S2 in asecond direction opposed to the first direction. The plug contacts2130-N may include upper plug contacts 2130 a disposed on the firstsurface 2110-S1, and lower plug contact 2130 b disposed on the secondsurface 2110-S2. When the receptacle 100 and the plug 2100 are coupledwith each other, the receptacle tongue 120-1 is inserted into thepassage 2110-P, and the receptacle contacts 130-N on the receptacletongue 120-1 may be electrically and respectively connected with theplug contacts 2130-N. For example, when the receptacle 100 and the plug2100 are coupled with each other, the upper plug contacts 2130 a may berespectively and electrically connected with the upper first contactsections 130-1SU, and the lower plug contacts 2130 b may be respectivelyand electrically connected with the lower first contact sections130-1SD. Alternatively, when the plug 2100 is inverted (rotated 180°)and coupled to the receptacle 100, the low plug contacts 2130 b may berespectively and electrically connected with the upper first contactsections 130-1SU, and the upper plug contacts 2130 a may be respectivelyand electrically connected with the lower first contact sections130-1SD.

Both the electric connection between the multiple plug contacts 2130-Nof the plug 2100 and the multiple upper first contact parts 130-1SU ofthe receptacle 100 and the electric connection between the multiple plugcontacts 2130-N of the plug 2100 and the multiple lower first contactparts 130-1SD of the receptacle 100 enable one-to-one connection betweenpre-designated contacts of the plug 2100 and the receptacle 100. Forexample, a connection may be made between a plug contact and areceptacle contact, which have been designated for a ground return path.Alternatively, a connection may be made between a plug contact and areceptacle contact, which have been designated for signal transfer. Inother words, even if the plug 2100 is inserted into the receptacle 100without distinguishing the top and bottom thereof, a correct electricconnection may be established between the plug 2100 and the receptacle100. Such a pair of plug 2100 and a receptacle 100 may be referred to asa “C-type plug”, a “reversible plug”, or a “reversible C-type plug” anda “C-type receptacle”, a “reversible receptacle”, or a “reversibleC-type receptacle”.

The multiple receptacle contacts 130-N include multiple second contactsections 130-2S, which extend from the multiple first contact sections130-1S and are electrically connected at suitable locations.

The circuit board may include multiple solder pads or lands, which canbe electrically connected to a large number of the multiple secondcontact sections 130-2S of the receptacle 100. Particularly, themultiple solder pads of the circuit board may be arranged in a row.

The multiple second contact sections 130-2S of the receptacle 100include multiple solder tails 130-2T for the sake of soldering atsuitable locations.

A large number of the multiple second contact sections 130-2S of thereceptacle 100 may be connected to the multiple solder pads of thecircuit board, respectively, one to one or alternatively, may beconnected together to one solder pad of the circuit board.

One or more of the multiple second contact sections 130-2S of thereceptacle 100 may be connected to the receptacle shell 110 and used asa ground return path.

One or more of the multiple second contact sections 130-2S of thereceptacle 100 may be connected to the mid-plate 120-20 of thereceptacle tongue 120 and used as a ground return path.

FIG. 3 schematically illustrates an arrangement of multiple receptaclecontacts of a receptacle tongue, according to an embodiment of thepresent disclosure.

Referring to FIG. 3, the multiple receptacle contacts 130-N includemultiple upper first contact sections 130-1SU and multiple lower firstcontact sections 130-1SD arranged on opposite surfaces 120-1S1 and120-1S2, which face each other, of the free end portion 120-1 of thereceptacle tongue 120, respectively, as shown in FIGS. 1 and 2.

The number of the multiple upper first contact sections 130-1SU and thenumber of the multiple lower first contact sections 130-1SD may beidentical. In addition, the multiple upper first contact sections130-1SU and the multiple lower first contact sections 130-1SD may haveone-to-one correspondence with each other, and the two sections 130-1SUand 130-1SD, which have one-to-one correspondence, may be set for thesame functions (for example, ground return path, data signal transfer,power signal transfer, etc.).

The multiple upper first contact sections 130-1 SU are arrangedaccording to the function, and the order of arrangement thereof may beopposite to the order of function-wise arrangement of the multiple lowerfirst contact sections 130-1SD.

The multiple upper first contact sections 130-1SU include at least oneof a first contact section 130-1SUA1 of a GND contact, a first contactsection 130-1SUA2 of a TX1+ contact, a first contact section 130-1SUA3of a TX1− contact, a first contact section 130-1SUA4 of a V_(bus)contact, a first contact section 130-1SU1A5 of a CC1 contact, a firstcontact section 130-1SUA6 of a D+ contact, a first contact section130-1SUA7 of a D− contact, a first contact section 130-1SUA8 of a SBU1contact, a first contact section 130-1SUA9 of a VBUS contact, a firstcontact section 130-1SUA10 of a RX2− contact, a first contact section130-1SUA11 of a RX2+ contact, and a first contact section 130-1SUA12 ofa GND contact, arranged from left to right.

The multiple lower first contact sections 130-1SD include at least oneof a first contact section 130-1SDB1 of a GND contact, a first contactsection 130-1SDB2 of a TX2+ contact, a first contact section 130-1SDB3of a TX2− contact, a first contact section 130-1SDB4 of a VBUS contact,a first contact section 130-1SDB5 of a CC2 contact, a first contactsection 130-1SDB6 of a D+ contact, a first contact section 130-1SDB7 ofa D− contact, a first contact section 130-1SDB8 of a SBU2 contact, afirst contact section 130-1SDB9 of a V_(bus) contact, a first contactsection 130-1SDB10 of a RX1− contact, a first contact section 130-1SDB11of a RX1+ contact, and a first contact section 130-1SDB12 of a GNDcontact, arranged from right to left.

In connection with the multiple upper first contact sections 130-1SU,there is arranged, between the first contact sections 130-1SUA1 and130-1SUA12 of a pair of GND contacts for ground connection, the firstcontact sections 130-SUA2, 130-SUA3, 130-SUA4, 130-SUA5, 130-SUA6,130-SUA7, 130-SUA8, 130-SUA9, 130-SUA10, and 130-SUA11 of the remainingcontacts.

In connection with the multiple lower first contact sections 130-1SD,there is arranged, between the first contact sections 130-1SDB1 and130-1SDB12 of a pair of GND contacts for ground connection, the firstcontact sections 130-1SDB2, 130-1SDB3, 130-1SDB4, 130-1SDB5, 130-1SDB6,130-1SDB7, 130-1SDB8, 130-1SDB9, 130-1SDB10, and 130-1SDB11 of theremaining contacts.

The multiple receptacle contacts 130-N may include multiple receptaclecontacts for supporting a communication interface (for example, USB 3.x)of an upper-level communication specification (or communication version)and multiple receptacle contacts for supporting a communicationinterface (for example, USB 2.x) of a lower-level communicationspecification, on the basis of consideration of downward compatibility.For example, the multiple receptacle contacts for solely supportingcommunication interface USB 2.x of the lower-level communicationspecification include a pair of V_(bus) contacts, a SBU2 contact, a CC1contact, a D+ contact, a D− contact, a D− contact, a D+ contact, a SBU1contact, a CC2 contact, and a pair of VBUS contacts.

When the user device supports only a communication interface of alower-level communication specification, the C-type receptacle 100mounted on the user device may be configured to solely have multiplereceptacle contacts for supporting a communication interface (forexample, USB 2.x) of the lower-level communication specification.

FIG. 4 illustrates coupling between a receptacle and a circuit board,according to an embodiment of the present disclosure.

Referring to FIG. 4, the circuit board 200 includes a penetrationportion 200-T shaped to be open towards one side thereof. The receptacleshell 110 is fitted to the penetration portion 200-T of the circuitboard 200, and the bottom surface 110-S2 of the receptacle shell 110does not protrude with regard to one surface 200-S2 of the circuit board200. For example, the bottom surface 100-S2 of the receptacle shell 110is flat, and is arranged at the same height as one surface 200-S2 of thecircuit board 200, which is flat.

A solder paste 410 is applied to the bottom surface 110-S2 of thereceptacle shell 110 and to one surface 200-S2 of the circuit board 200.Using soldering, in addition, the metal plate 420 is coupled both to thebottom surface 110-S2 of the receptacle shell 110 and to one surface200-S2 of the circuit board 200 via the solder paste 410. The circuitboard 200 and the receptacle shell 110 are thereby coupled via the metalplate 420.

The receptacle shell 110 may be metal, and is electrically connected tothe circuit board 200 via the solder paste 410 and the metal plate 420.In this configuration, the receptacle shell 110 and the metal plate 420are used as a ground return path of the circuit board 200.

The circuit board 200 includes multiple component holes or deep holes200-H arranged around the penetration portion 200-T. Multiple leads110-L1 and 110-L2 of the receptacle 100 are inserted into the multiplecomponent holes 200-H of the circuit board 200, with their endsprotruding to the opposite surface 200-S2 of the circuit board 200. Thecircuit board 200 may have a land (or copper foil pad) for solderingprovided around the multiple component holes 200-H. The land may have anannular shape. And the multiple leads 110-L1 and 110-L2 may have endscoupled to the land of the circuit board 200 using soldering.

At least one lead of the receptacle 100 may be shaped to extend from aside portion of the receptacle shell 110 in the horizontal direction,and may be coupled to the corresponding land of the circuit board usingsoldering.

The land of the circuit board 200 is electrically connected to theground of the circuit board 200. Therefore, the receptacle shell 110 maybe used as a ground return path of the circuit board 200.

The opening 110-O of the receptacle shell 110 is directed towards theoutside of the circuit board 200. The opening 110-O of the receptacleshell 110 protrudes relative to the edge 200-E of the circuit board 200,and this arrangement structure facilitates forcing the opening 100-O ofthe receptacle 100 against a through-hole for plug entry/exit of a frameof the user device. And the space D between the opening 110-O of thereceptacle 100 and the edge 200-E of the circuit board 200 is occupiedby a case frame of the user device, and the receptacle 100 can besupported by the frame of the user device.

As illustrated in FIG. 4, the receptacle 100 is installed in such amanner that a part thereof is inserted into the penetration portion200-T of the circuit board 200, and such a manner of installing thereceptacle 100 may be referred to as a “mid-mount”. Compared with astructure of installing a receptacle 100 on a surface of a circuit board200, the mid-mount installation structure can reduce the thickness ofthe portion of coupling between the receptacle 100 and the circuit board200.

FIG. 5 illustrates coupling between a receptacle and a circuit board,according to another embodiment of the present disclosure.

Referring to FIG. 5, the circuit board 500 includes multiple componentholes 500-H. The bottom surface 110-S2 of the receptacle shell 110 abutsone surface 500-S1 of the circuit board 500, and multiple leads 110-L1and 110-L2 of the receptacle 100 are inserted into the multiplecomponent holes 500-H of the circuit board 200, respectively.

The multiple leads 110-L1 and 110-L2 of the receptacle 100 are insertedinto the multiple component holes 500-H of the circuit board 500, withtheir ends protruding to the opposite surface 500-S2 of the circuitboard 500. The circuit board 500 may have a land (or copper foil pad;not illustrated) for soldering provided around the multiple componentholes 500-H. The multiple leads 110-L1 and 110-L2 may have ends coupledto the land of the circuit board 500 using soldering.

As illustrated in FIG. 5, the receptacle 100 is installed on one surface500-S1 of the circuit board 500, and such a manner of installing thereceptacle 100 may be referred to as a “top mount”.

FIG. 6A illustrates a coupling state between a receptacle and a circuitboard, according to an embodiment of the present disclosure. FIG. 6Billustrates a coupling state between a receptacle and a circuit boardwith parts of a receptacle shell removed, according to an embodiment ofthe present disclosure. FIG. 6C illustrates a part of a coupling statebetween a receptacle and a circuit board, according to an embodiment ofthe present disclosure.

Referring to FIG. 6A to FIG. 6C, multiple receptacle contacts 130-N ofthe C-type receptacle 100 include multiple first contact sections 130-1Sarranged on opposite surfaces, which face each other, of the free endportion 120-1 of the receptacle tongue 120, respectively. And themultiple receptacle contacts 130-N include multiple second contactsections 120-2S, which extend from the first contact sections 130-1S andare electrically connected to the circuit board 200.

The circuit board 200 includes multiple solder pads 200-P for soldering.Particularly, the multiple solder pads 200-P may be arranged in a row.

As shown in FIG. 6B, the direction 601 of the arrangement of themultiple solder pads 200-P of the circuit board 200 may be perpendicularto the direction 602 of an extension of the multiple first contactsections 130-1S of the multiple receptacle contacts 130-N.

The multiple solder pads 200-P of the circuit board 200 are arrangedbetween a pair of component holes 200-H21 and 200-H22.

The number of the multiple solder pads 200-P of the circuit board 200may be equal to or smaller than the number of multiple receptaclecontacts 130-N of the receptacle 100.

The multiple second contact sections 130-2S of the multiple receptaclecontacts 130-N may have solder tails 130-2T for soldering. A largenumber of the solder tails 130-2T of the multiple second contactsections 130-2S may be coupled, one to one, to the multiple solder pads200-P of the circuit board 200 using soldering, respectively, or may,alternatively, be coupled together to one solder pad of the circuitboard 200. For example, two or more solder tails may be overlapped ontoone solder pad of the circuit board 200 in the vertical direction.Alternatively, when the solder pads of the circuit board 200 have asufficient area, two or more solder tails may be coupled to one solderpad of the circuit board 200 in parallel with each other in thehorizontal direction.

The portion of coupling between the solder tails 130-2T of the multiplesecond contact sections 130-2S and the multiple solder pads 200-P of thecircuit board 200 occurs while being covered by the receptacle shell110.

The mid-plate 120-20 of the receptacle tongue 120 is fixed on the baseplate 120-10. It is to be noted that, although the lower-side base plate120-10 is illustrated in FIG. 6C, illustration of the other base platethat covers at least a part of the mid-plate 120-20 is omitted forconvenience of description.

The mid-plate 120-20 of the receptacle tongue 120 includes a pair ofleads 120-2L21 and 120-2L22. The pair of leads 120-2L21 and 120-2L22extend towards both sides near a location between the multiple firstcontact sections 130-1S and the multiple second contact sections 130-2Sof the multiple receptacle contacts 130-N.

The pair of leads 120-2L21 and 120-2L22 of the mid-plate 120-20 iselectrically connected to a pair of components holes 200-H21 and 200-H22of the circuit board 200.

FIG. 7A illustrates a coupling state between a receptacle and a circuitboard, according to the prior art. FIG. 7B illustrates a coupling statebetween a receptacle and a circuit board, according to the prior art,with parts of a receptacle shell removed. FIG. 7C illustrates a part ofa coupling state between a receptacle and a circuit board, according tothe prior art. FIG. 7D illustrates a mid-plate and multiple receptaclecontacts of a receptacle, according to the prior art.

Referring to FIG. 7A to FIG. 7D, a receptacle 1110 and a circuit board1200 of the prior art are provided. The receptacle 1100 includesmultiple receptacle contacts 1130-N. The multiple receptacle contacts1130-N of the receptacle 1100 include solder tails 1130-2T coupled tomultiple solder pads 1200-P of the circuit board 1200 using soldering.In this configuration, the multiple solder pads 1200-P of the circuitboard 1200 may be arranged in two rows. In addition, the circuit board1200 includes a pair of ground connection component holes 1200-H3 and1200H4, and the multiple solder pads 1200-P are arranged between thepair of ground connection component holes 1200-H3 and 1200-H4. The pairof ground connection component holes 1200-H3 and 1200-H4 is electricallyconnected to the ground of the circuit board 1200. Both ends 1120-2L3and 1120-2L4 of the mid-plate 1120 of the receptacle 1100 are insertedinto the pair of ground connection component holes 1200-H3 and 1200-H4of the circuit board 1200 and then soldered, and the mid-plate 1120 isused as a ground return path of the circuit board 1200. And the pair ofground connection component holes 1200-H3 and 1200-H4 of the circuitboard 1200 are arranged between another pair of receptacle couplingcomponent holes 1200-H21 and 1200-H22 of the circuit board 1200. In thisconfiguration, a pair of leads 1110-L21 and 1110-L22 of the receptacle1100 are inserted into the pair of receptacle coupling component holes1200-H21 and 1200-H22 and then soldered, and the receptacle 1100 isthereby coupled to the circuit board 1200.

FIG. 8 is a diagram comparing a coupling state between multiplereceptacle contacts and a circuit board, according to the prior art, anda coupling state between multiple receptacle contacts and a circuitboard, according to an embodiment of the present disclosure.

Referring to FIG. 8, a circuit board 1200 of the prior art and a circuitboard 200 of an embodiment of the present invention are provided.According to an embodiment of the present invention, the number ofmultiple solder pads 200-P of the circuit board 200 is smaller than thenumber of solder pads 1200-P of the circuit board 1200.

One of the multiple solder pads 200-P of the circuit board 200 may bemultiple pads 801, 802, and 803, which are coupled together on thecircuit board 1200.

The circuit board 200 does not include a pair of ground connectioncomponent holes 1200-H3 and 1200-H4 as does the circuit board 1200, butinstead uses a pair of receptacle coupling component holes 200-H21 and200-H22 for ground connection. For example, according to an embodimentof the present invention, a pair of leads 120-2L21 and 120-2L22 (FIG.6C) of the mid-plate 120-20 of the receptacle tongue 120 areelectrically connected to the pair of receptacle coupling componentholes 200-H21 and 200-H22 of the circuit board 200. Additionally, thepair of leads 110-2L21 and 110-2L22 (FIG. 3) of the receptacle shell 110are electrically connected to the pair of components holes 200-H21 and200-H22 of the circuit board 200. And the pair of receptacle couplingcomponent holes 200-H21 and 200-H22 is electrically connected to theground of the circuit board 200. Therefore, the mid-plate 120-20 of thereceptacle tongue 120 may be used as a ground return path of the circuitboard 200 together with the receptacle shell 110.

Compared with the circuit board 1200 of the prior art, the circuit board200 of an embodiment of the present disclosure has a reduced number ofsolder pads 200-P, and thus, an area or space for additional componentmounting can be secured on the circuit board 200. Furthermore, comparedwith the circuit board 1200 of the prior art, the circuit board 200 ofan embodiment of present disclosure provides solder pads 200-P arrangedin a row, further securing an area or space for additional componentmounting on the circuit board 200.

Additionally, compared with the receptacle 1100 of the prior art, themid-plate 120-20 of the receptacle tongue 120 of an embodiment of thepresent invention is connected to a pair of component holes 200-H12 and200H22 of the circuit board 200, which are used to fix a pair of leads110-L21 and 110-L22 of the receptacle shell 110 to the circuit board200, making it unnecessary to configure separate ground connectioncomponent holes 1200-H3 and 1200-H4 on the circuit board 200. Therefore,the circuit board 200 does not include ground connection component holes1200-H3 and 1200H4, resulting in an area or space in which additionalcomponent mounting can be secured on the circuit board 200.

Additionally, compared with the receptacle 1100 of the prior art, thereceptacle 100 of an embodiment of the present invention is connected tomultiple solder pads 200-P arranged in a row on the circuit board 200,thereby reducing the size of the receptacle 100. Reduction in size ofthe receptacle 100 secures a corresponding area or space for componentmounting on the circuit board 200.

FIG. 9 illustrates a coupling state between multiple receptacle contactsand a circuit board, according to an embodiment of the presentdisclosure.

Referring to FIG. 9, the multiple solder pads 200-P of the circuit board200 are separate from each other, and are arranged in a row.

The multiple solder pads 200-P of the circuit board 200 are eachseparated from each other an interval W, which may be constant orvariable.

Each of the multiple solder pads 200-P of the circuit board 200 has athickness T, which may be constant or variable.

The multiple solder pads 200-P of the circuit board 200 may have thesame shape or different shapes. For example, the multiple solder pads200-P of the circuit board 200 may be approximately quadrangular.

The multiple receptacle contacts 130-N include multiple second contactsections 130-2S, which extend from the multiple first contact sections130-1S arranged on the receptacle tongue 120. The multiple secondcontact sections 130-2S include multiple solder tails 130-2T coupled tothe multiple solder pads 200-P of the circuit board 200.

A solder tail 130-2T of one of the multiple second contact sections130-2S may be coupled to one pad 200-P1, 200-P2, 200-P3, 200-P4, 200-P6,200-P10, 200-P11, or 200-P12 of the circuit board 200.

At least two solder tails 130-2T of the multiple second contact sections130-2S may be coupled together to one pad 200-P5, 200-P8, 200-P9, or200-P12 of the circuit board 200. For example, the at least two soldertails 120-2T may be overlapped.

The multiple second contact sections 130-2S include connection portions130-2C that connect between the solder tails 130-2T and the multiplefirst contact sections 130-1S. The connection portions 130-2C of themultiple second contact sections 130-2S may be shaped such that they donot contact each other. For example, some of the connection portions130-2C of the multiple second contact sections 130-2S may have shapes901 similar to each other. Alternatively, some of the connectionportions 130-2C of the multiple second contact sections 130-2S may haveshapes 903 so as to intersect with each other.

FIG. 10 illustrates a part of a receptacle, according to an embodimentof the present disclosure.

Referring FIG. 10, the receptacle 100 includes multiple receptaclecontacts 130-N and a mid-plate 120-20.

The multiple receptacle contacts 130-N include, with reference to themid-plate 120-20, multiple upper first contact sections 130-1SU arrangedabove the mid-plate 120-20, and multiple lower first contact sections130-1SD arranged below the mid-plate 120-20. The multiple upper firstcontact sections 130-1SU and/or the multiple lower first contactsections 130-1SD have the shape of elongated plates. A length L of themultiple upper first contact sections 130-1SU and/or the multiple lowerfirst contact sections 130-1SD may be constant or, as illustrated, maybe variable. Additionally, a width W and a thickness T of the multipleupper first contact sections 130-1SU and/or the multiple lower firstcontact sections 130-1SD may be constant or variable. The multiplereceptacle contacts 130-N include multiple second contact sections130-2S extending from the multiple upper first sections 130-1SU and themultiple lower first contact sections 130-1SD.

At least one of the multiple upper first contact sections 130-1SU and/orthe multiple lower first contact sections 130-1SD are electricallyconnected to the mid-plate 120-20 and used as a ground return path. Forexample, an end EA12 of one 130-1SUA12 of the multiple upper firstcontact sections 130-1SU, which is arranged on the outer side of theupper side of the mid-plate 120-20, may extend towards the mid-plate120-20, and this end EA12 is electrically connected to the mid-plate120-20. And, an end EB1 of one 130-1SUB1 of the multiple lower firstcontact sections 130-1SD, which is arranged on the outer side of thelower side of the mid-plate 120-20, may extend towards the mid-plate120-20, and this end EB1 is electrically connected to the mid-plate120-20.

FIG. 11 illustrates a coupling state between multiple receptaclecontacts and a circuit board, according to an embodiment of the presentdisclosure.

Referring to FIG. 11, the multiple solder tails 130-2T of the multiplereceptacle contacts 130-N are coupled together to one solder pad 200-Pof the circuit board 200. For example, the area of one solder pad200-P12 of the circuit board 200 may be sufficient for two solder tails130-2T2 and 130-2T3 of two receptacle contacts 130-N to be coupledthereto, and in this case, the two solder tails 130-2T2 and 130-2T3 arecoupled to one solder pad 200-P12 of the circuit board 200 in parallelwith each other in the horizontal direction.

FIG. 12 is a partial sectional view of a receptacle, according to anembodiment of the present disclosure.

Referring to FIG. 12, the receptacle 100 includes a receptacle shell110, a receptacle tongue 120, and multiple receptacle contacts 130-N.

The receptacle shell 110 has an annular shape having upper/lower andleft/right symmetry. For example, the upper and lower portions TP and BPof the receptacle shell 110 may both be straight and parallel to oneanother, and the left and right portions LP and RP of the receptacleshell 110 may both be curved at the same angle.

The receptacle tongue 120 is arranged inside a passage 110-O of thereceptacle shell 110. The receptacle tongue 120 includes a fixed portion120-2, which is fixed to the inner surface of the passage 110-O of thereceptacle shell 110, and a free end portion 120-1, which is connectedto the fixed portion 120-2. The free end portion 120-1 does not contactthe inner surface of the passage 110-O of the receptacle shell 110, andhas a plate shape.

The receptacle tongue 120 includes a mid-plate 120-20. A part of themid-plate 120-20 is arranged inside the free end portion 120-1, andanother part of the mid-plate 120-20 includes a pair of leads 120-2L21and 120-2L22 extending to opposite sides. As described above, the pairof leads 120-2L21 and 120-2L22 may be inserted into a pair of componentholes 200-H21 and 200-H22 (FIG. 8) of the circuit board 200 and coupledthereto.

The multiple receptacle contacts 130-N include multiple upper firstcontact sections 130-1SU and multiple lower first contact sections130-1SD, which are arranged on the free end portion 120-1 of thereceptacle tongue 120. And the multiple receptacle contacts 130-Ninclude multiple second contact sections 130-2S extending from themultiple upper first sections 130-1SU and the multiple lower firstcontact sections 130-1SD.

A solder tail 130-2T of a second contact section 130-2S extending fromat least one of the multiple upper first contact sections 130-1SU may beconnected at a suitable location and used as a ground return path.

For example, a solder tail 130-2TU21 or 130-2TU22 of a second contactsection 130-2S extending from at least one of the multiple upper firstcontact sections 130-1SU may be electrically connected to a componenthole 200-H21 or 200-H22 (FIG. 8) of the circuit board 200.

Alternatively, at least one solder tail of a second contact section130-2S extending from at least one of the multiple upper first contactsections 130-1SU may be electrically connected to the receptacle shell110. For example, at least one solder tail of a second contact section130-2S extending from at least one of the multiple upper first contactsections 110-1SU may be electrically connected to a lead 110-L21 or110-L22 of the receptacle shell 110.

Alternatively, at least one solder tail of a second contact section130-2S extending from at least one of the multiple upper first contactsections 130-1SU may be electrically connected to the receptacle tongue120. For example, at least one solder tail of a second contact section130-2S extending from at least one of the multiple upper first contactsections 130-1SU may be electrically connected to the mid-plate 120-20.

The solder tail 130-2TU21 of a second contact section 130-2S extendingfrom one of the multiple upper first contact sections 130-1SU, which isrelatively arranged to the left, may be electrically connected to one ofa component hole 200-H21 of the circuit board 200, the receptacle shell110, and the mid-plate 120-20 of the receptacle tongue 120.

Additionally, a solder tail 130-2TD21 of a second contact section 130-2Sextending from one of the multiple lower contact sections 130-1SD, whichis relatively arranged to the left, may be electrically connected to oneof a component hole 200-H21 of the circuit board 200, the receptacleshell 110, and the mid-plate 120-20 of the receptacle tongue 120.

The solder tail 130-2TU21 of a second contact section 130-2S extendingfrom one of the multiple upper first contact sections 130-1SU, which isrelatively arranged to the left, and a solder tail 130-2TD21 of a secondcontact section 130-2S extending from one of the multiple lower firstcontact sections 130-1SD, which is relatively arranged to the left, maycoincide.

The solder tail 130-2TU22 of a second contact section 130-2S extendingfrom one of the multiple upper first contact sections 130-1SU, which isrelatively arranged to the right, may be electrically connected to oneof a component hole 200-H22 of the circuit board 200, the receptacleshell 110, and the mid-plate 120-20 of the receptacle tongue 120.

Additionally, a solder tail 130-2TD22 of a second contact section 130-2Sextending from one of the multiple lower first contact sections 130-1SD,which is relatively arranged to the right, may be electrically connectedto one of a component hole 200-H22 of the circuit board 200, thereceptacle shell 110, and the mid-plate 120-20 of the receptacle tongue120.

The solder tail 130-2TU22 of a second contact section 130-2S extendingfrom one of the multiple upper first contact sections 130-1SU, which isrelatively arranged to the right, and a solder tail 130-2TD22 of asecond contact section 130-2S extending from one of the multiple lowerfirst contact sections 130-1SD, which is relatively arranged to theright, may coincide.

FIG. 13 and FIG. 14 illustrate parts of a receptacle, according to anembodiment of the present disclosure.

Referring to FIG. 13 and FIG. 14, the receptacle 100 includes amid-plate 120-20 and multiple receptacle contacts 130-N.

The mid-plate 120-20 includes a first section 120-201S1, which has aplate shape, and a pair of leads 120-2L21 and 120-2L22, which extendsfrom the first section 120-201S1 towards opposite sides.

The pair of leads 120-2L21 and 120-2L22 are plate shaped having smallwidths, such that they extend in the horizontal direction near a placebetween the multiple first contact sections 130-1S and the multiplesecond contact sections 130-2S of the multiple receptacle contacts 130-Nand then bent in the vertical direction.

The multiple receptacle contacts 130-N include multiple upper firstcontact sections 130-1SU and multiple lower first contact sections130-1SD. In this configuration, the first section 120-201S1 of themid-plate 120-20 are arranged between the multiple upper first contactsections 130-1SU and the multiple lower first contact sections 130-1SD.

At least one of the multiple receptacle contacts 130-N is electricallyconnected to the mid-plate 120-20 and used as a ground return path. Endsof upper first contact sections 130-1SUA1 and 130-1SUA12 and lower firstcontact sections 130-1SDB1 and 130-1SDB12, which are relatively arrangedon the outer side, among the multiple receptacle contacts 130-N, areelectrically connected to the mid-plate 120-20 and used as a groundreturn path 1301.

The multiple receptacle contacts 130-N include multiple second contactsections 130-2S extending from the multiple upper first sections 130-1SUand the multiple lower first contact sections 130-1SD. And the multiplesecond contact sections 130-2S include multiple solder tails 130-2T thatcan be connected to the circuit board 200.

The multiple solder tails 130-2T are arranged in a row. And the order ofarrangement of the multiple solder tails 130-2T may be diversified. Forexample, solder tails 130-2T of the multiple receptacle contacts 130-Nfor the same function may be arranged adjacent to each other 1303.

For example, as shown in FIG. 14, a solder tail 130-2TU/VBUS1, whichextends from an upper first contact section 130-1SU/VBUS1, and a soldertail 130-2TD/VBUS1, which extends from a lower first contact section130-2TD/VBUS1, may be for the purpose of a “VBUS1” function, and arearranged adjacent to each other.

For example, as shown in FIG. 14, a solder tail 130-2TU/USB1−, whichextends from an upper first contact section 130-1SU/USB1−, and a soldertail 130-2TD/USB1−, which extends from a lower first contact section130-1SD/USB1−, may be for the purpose of a “USB 1−” function, and arearranged adjacent to each other.

For example, as shown in FIG. 14, a solder tail 130-2TU/VBUS2, whichextends from an upper first contact section 130-1SU/VBUS2, and a soldertail 130-2TD/VBUS2, which extends from a lower first contact section130-1SD/VBUS2, may be for the purpose of a “VBUS2” function, and arearranged adjacent to each other.

For example, as shown in FIG. 14, a solder tail 130-2TD/USB1+, whichextends from a lower first contact section 130-1SD/USB1+ assigned to a“USB1+” function, is not adjacent to other solder tails.

For example, as shown in FIG. 14, a solder tail 130-2TU/USB2+, whichextends from an upper first contact section 130-1SU/USB2+ assigned to a“USB2+” function, is not adjacent to other solder tails.

For example, as shown in FIG. 14, the solder tail 130-2TU/USB1− and thesolder tail 130-2TD/USB1−, which are assigned to a “USB1−” function, areadjacent to each other, and are arranged between the solder tail130-2TD/USB1+, which is assigned to a “USB1+” function, and the soldertail 130-2TU/USB2+, which is assigned to a “USB2+” function.

The multiple solder tails 130-2T have shapes similar to those obtainedby bending partial ends of multiple second contact sections 130-2S ofthe multiple receptacle contacts 130-N. Multiple solder tails 130-2TU,which extend from the multiple upper first contact sections 130-1SU,have shapes similar to those obtained by bending partial ends of themultiple second contact sections 130-2S towards the opening 110-O(FIG. 1) of the receptacle 100. And multiple solder tails 130-2TD, whichextend from the multiple lower first contact sections 130-1SD, haveshapes similar to those obtained by bending partial ends of the multiplesecond contact sections 130-2S so as to face away 1403 from the opening110-O (FIG. 1) of the receptacle 100. This configuration aids inphysical separation between the multiple second contact sections 130-2S,which extend from the multiple upper first contact sections 130-1SU, andthe multiple second contact sections 130-2S, which extend from themultiple lower first contact sections 130-1SD.

FIG. 15 illustrates an arrangement of solder tails of multiplereceptacles, which are adjacent to each other, according to anembodiment of the present disclosure.

Referring to FIG. 15, solder tails 130-2T21 and 130-2T22 of multiplereceptacle contacts 130-N for the same function (for example, powersignal transfer, data signal transfer, etc.) are arranged adjacent toeach other and soldered 1501 to solder pad P of the circuit board 200.

A narrow gap T is provided between two adjacent solder tails 130-2Tbecause solder rising may occur during soldering. Alternatively, partsof two solder tails 130-2T may be forced against each other, while otherparts are separated from each other to provide a space, which may beused to prepare against solder rising.

FIG. 16 illustrates an arrangement of multiple first contact sectionsarranged on a free end portion of a receptacle tongue in connection withmultiple receptacle contacts, and an arrangement of solder pads on acircuit board, on which solder tails of multiple second contact sectionsextending from the multiple first contact sections are to be installed,according to an embodiment of the present disclosure.

Referring to FIG. 16, in connection with multiple receptacle contacts130-N, multiple first contact sections 130-1S include multiple upperfirst contact sections 130-1SU, which are arranged on the upper surface1201S1 of the free end portion 1201 of the receptacle tongue 120, andmultiple lower first contact sections 130-1SD, which are arranged on thelower surface 1201S2 of the free end portion 1201 of the receptacletongue 120. For example, the multiple upper first contact sections130-1SU may amount to twelve, and may include a first contact section130-1SUA1 of a GND contact, a first contact section 130-1SUA2 of a TX1+contact, a first contact section 130-1SUA3 of a TX1− contact, a firstcontact section 130-1SUA4 of a V_(bus) contact, a first contact section130-1SUA5 of a CC1 contact, a first contact section 130-1SUA6 of a D+contact, a first contact section 130-1SUA7 of a D− contact, a firstcontact section 130-1SUA8 of a SBU1 contact, a first contact section130-1SUA9 of a VBUS contact, a first contact section 130-1SUA10 of aRX2− contact, a first contact section 130-1SUA11 of a RX2+ contact, or afirst contact section 130-1SUA12 of a GND contact. And the multiplelower first contact sections 130-SD may amount to twelve, and mayinclude a first contact section 130-SDB1 of a GND contact, a firstcontact section 130-SDB2 of a TX2+ contact, a first contact section130-SDB3 of a TX2− contact, a first contact section 130-SDB4 of a VBUScontact, a first contact section 130-SDB5 of a CC2 contact, a firstcontact section 130-SDB6 of a D+ contact, a first contact section130-SDB7 of a D− contact, a first contact section 130-SDB8 of a SBU2contact, a first contact section 130-SDB9 of a V_(bus) contact, a firstcontact section 130-SDB10 of a RX1− contact, a first contact section130-SDB11 of a RX1+ contact, or a first contact section 130-SDB12 of aGND contact.

Solder pads 200-P on the circuit board 200, on which solder tails 130-2Tof multiple second contact sections 130-2S extending from multiple firstcontact sections 130-1S are to be installed, are arranged in a row.

At least one of the solder pads 200-P on the circuit board 200 may beused to install a pair of solder tails 130-2T extending from a pair offirst contact sections 130-1S, which are assigned to the same function(for example, power signal transfer, data signal transfer, etc.), amongmultiple first contact sections 130-1S.

The number (for example, 16 or 17) of the multiple solder pads 200-P onthe circuit board 200 may be smaller than the number (for example, 24)of the multiple first contact sections 130-1S of the multiple receptaclecontacts 130-N.

The multiple solder pads 200-P on the circuit board 200 may amount tosixteen, and may be arranged in the following order. For example, thesixteen solder pads 200-P includes a first solder pad 200-PA2 assignedto a TX1+ contact, a second solder pad 200-PA3 assigned to a TX1−contact, a third solder pad 200-PB11 assigned to a RX1+ contact, afourth solder pad 200-PB10 assigned to a RX1− contact, a fifth solderpad 200-PA4B9 assigned to a pair of V_(bus) contacts, a sixth solder pad200-PB8 assigned to a SBU2 contact, a seventh solder pad 200-PA5assigned to a CC1 contact, an eighth solder pad 200-PA6B6 assigned to apair of D+ contacts, a ninth solder pad 200-PA7B7 assigned to a pair ofD− contacts, a tenth solder pad 200-PA8 assigned to a SBU1 contact, aneleventh solder pad 200-PB5 assigned to a CC2 contact, a twelfth solderpad 200-PA9B4 assigned to a pair of VBUS contacts, a thirteenth solderpad 200-PA10 assigned to a RX2− contact, a fourteenth solder pad200-PA11 assigned to a RX2+ contact, a fifteenth solder pad 200-PB3assigned to a TX2− contact, and a sixteenth solder pad 200-PB2 assignedto a TX2+ contact, arranged from left to right.

The order of arrangement among the first solder pad 200-PA2, the secondsolder pad 200-PA3, the third solder pad 200-PB11, and the fourth solderpad 200-PA4B9 may be changed. Alternatively, the order of arrangementbetween the sixth solder pad 200-PB6 and the seventh solder pad 200-PA5may be changed. Alternatively, the order of arrangement between thetenth solder pad 200-PA8 and the eleventh solder pad 200-PA5 may bechanged. Alternatively, the order of arrangement among the thirteenthsolder pad 200-PA10, the fourteenth solder pad 200-PA11 the fifteenthsolder pad 200-PB3, and the sixteenth solder pad 200-PB2 may be changed.

FIG. 17 illustrates changing an order of arrangement of solder pads on acircuit board, according to an embodiment of the present disclosure.

Referring to FIG. 17, the order of arrangement of solder pads board200-P, as illustrated in FIG. 16, is changed to an order of solder pads200-P(1). The order of arrangement between a second solder pad 200-PA3,which is assigned to a TX1− contact, and a third solder pad 200-PB11,which is assigned to a RX1+ contact, may be changed. Alternatively, theorder of arrangement between a sixth solder pad 200-PB8, which isassigned to a SBU2 contact, and a seventh solder pad 200-PA5, which isassigned to a CC1 contact, may be changed. Alternatively, the order ofarrangement between a third solder pad 200-PA6B6, which is assigned to apair of D+ contacts, and a ninth solder pad 200-PA7B7, which is assignedto a pair of D− contacts, may be changed. Alternatively, the order ofarrangement between a tenth solder pad 200-PA8, which is assigned to aSBU1 contact, and an eleventh solder pad 200-PB5, which is assigned to aCC2 contact, may be changed. Alternatively, the order of arrangementbetween a fourteenth solder pad 200-PA11 which is assigned to a RX2+contact, and a fifteenth solder pad 200-PA3, which is assigned to a TX2−contact, may be changed.

FIG. 18 illustrates an arrangement of solder pads on a circuit board, onwhich solder tails of multiple second contact sections are to beinstalled, in connection with receptacle contacts, according to anembodiment of the present disclosure.

Referring to FIG. 18, an arrangement of solder pads 200-P(2) isprovided. The solder pads 200-P(2) on the circuit board 200 may amountto seventeen, and may be arranged in the following order. For example,the seventeen solder pads 200-P(2) include a first solder pad 200-PA2assigned to a TX1+ contact, a second solder pad 200-PA3 assigned to aTX1− contact, a third solder pad 200-PB11 assigned to a RX1+ contact, afourth solder pad 200-P10 assigned to a RX1− contact, a fifth solder pad200-PA4B9 assigned to a pair of V_(bus) contacts, a sixth solder pad200-PB8 assigned to a SBU2 contact, a seventh solder pad 200-PA5assigned to a CC1 contact, an eighth solder pad 200-PA6 assigned to a D+contact, a ninth solder pad 200-PA7B7 assigned to a pair of D-contacts,a tenth solder pad 200-PB6 assigned to a D+ contact, an eleventh solderpad 200-PA8 assigned to a SBU1 contact, a twelfth solder pad 200-PB5assigned to a CC2 contact, a thirteenth solder pad 200-PA9B4 assigned toa pair of VBUS contacts, a fourteenth solder pad 200-PA10 assigned to aRX2− contact, a fifteenth solder pad 200-PA11 assigned to a RX2+contact, a sixteenth solder pad 200-PB3 assigned to a TX2-contact, and aseventeenth solder pad 200-PB2 assigned to a TX2+ contact, arranged fromleft to right.

FIG. 19 illustrates an arrangement of multiple first contact sectionsarranged on a free end portion of a receptacle tongue in connection withmultiple receptacle contacts, and an arrangement of solder pads on acircuit board, on which solder tails of multiple second contact sectionsextending from the multiple first contact sections are to be installed,according to an embodiment of the present disclosure.

Referring to FIG. 19, an arrangement of multiple first contact sections200-P(3) arranged on a free end portion of a receptacle tongue inconnection with multiple receptacle contacts 130-N is provided. Themultiple receptacle contacts 130-N of the C-type receptacle 100 mountedon the user device includes multiple receptacle contacts for supportinga communication interface (for example, USB 3.x) of an upper-levelcommunication specification and multiple receptacle contacts forsupporting a communication interface (for example, USB 2.x) of alower-level communication specification, on the basis of considerationof downward compatibility. For example, the multiple receptacle contacts130-N for solely supporting communication interface USB 2.x of thelower-level communication specification may include a pair of V_(bus)contacts, a SBU2 contact, a CC1 contact, a D+ contact, a D− contact, aD− contact, a D+ contact, a SBU1 contact, a CC2 contact, and a pair ofVBUS contacts.

When the user device supports only a communication interface of alower-level communication specification, the C-type receptacle 100mounted on the user device may be configured to solely have multiplereceptacle contacts 130-N for supporting a communication interface (forexample, USB 2.x) of the lower-level communication specification.

Alternatively, when the user device supports only a communicationinterface of a lower-level communication specification, the C-typereceptacle 100 mounted on the user device may be configured to solelyhave multiple receptacle contacts 130-N for supporting a communicationinterface (for example, USB 2.x) of the lower-level communicationspecification, and multiple receptacle contacts for supporting thecommunication interface (for example, USB 3.x) of the upper-levelcommunication specification may be removed. Therefore, multiple firstcontact sections of the removed multiple receptacle contacts 130-N arenot be arranged on the free end portion of the receptacle tongue. Forexample, among the multiple upper first contact sections 130-1SU of themultiple receptacle contacts 130-N, illustrated in FIG. 16, the firstcontact section 130-1SUA2 of the TX1+ contact, the first contact section130-1SUA3 of the TX1− contact, the first contact section 130-1SUA10 ofthe RX2− contact, and the first contact section 130-1SUA11 of the RX2+contact may be removed. Furthermore, among the multiple lower firstcontact sections 130-1SD of the multiple receptacle contacts 130-N,illustrated in FIG. 16, the first contact section 130-SDB2 of the TX2+contact, the first contact section 130-SDB3 of the TX2− contact, thefirst contact section 130-SDB10 of the RX1− contact, and the firstcontact section 130-SDB11 of the RX1+ contact may be removed. And, afterthe multiple receptacle contacts 130-N for supporting the communicationinterface of the upper-level communication specification are removed,the remaining multiple receptacle contacts 130-N may be arrangedvariously on the basis of consideration of the C-type receptacle.

Solder pads 200-P on the circuit board 200, on which solder tails 130-2Tof multiple second contact sections 130-2S extending from multiple firstcontact sections 130-1S are to be installed, are solely for the purposeof supporting a communication interface (USB 2.x) of the lower-levelcommunication specification, and may be arranged in a row in variousorders. For example, the solder pads 200-P of the circuit board 200 mayamount to twelve, and may include a first solder pad 200-PA4 assigned toa V_(bus) contact, a second solder pad 200-PB9 assigned to a Vbuscontact, a third solder pad 200-PA5 assigned to a SBU2 contact, a fourthsolder pad 200-PB8 assigned to a CC1 contact, a fifth solder pad 200-PA6assigned to a D+ contact, a sixth solder pad 200-PA7 assigned to a D−contact, a seventh solder pad 200-PB7 assigned to a D− contact, aneighth solder pad 200-PB6 assigned to a D+ contact, a ninth solder pad200-PA8 assigned to a SBU1 contact, a tenth solder pad 200-PB5 assignedto a CC2 contact, an eleventh solder pad 200-PA9 assigned to VBUScontact, and a twelfth solder pad 200-PB4 assigned to a VBUS contact,arranged from left to right.

FIG. 20 is a perspective view of an electronic device, according to anembodiment of the present disclosure. And FIG. 21 is a perspective viewof an electronic device viewed in various directions, according to anembodiment of the present disclosure.

Referring to FIG. 20 and FIG. 21, electronic device 2000 includes afront cover 1, which is approximately shaped as a quadrangularrectangle, and which forms the front F of the electronic device 2000,and a back cover 2, which forms the back B of the electronic device2000. In addition, the electronic device 2000 includes a bezel 3 whichsurround the space between the front cover 1 and the back cover 2. Inaddition, the electronic device 2000 includes a display device containedin the space formed by the front cover 1 and the back cover 2. In thisconfiguration, the screen area of the display device exposed to theoutside via the front cover 1.

The front cover 1 and/or the back cover 2 may be made of glass.

The bezel 3 may be made of a non-metallic material or a metal.

The front F includes a first edge 1E1, a second edge 1E2, a third edge1E3, and a fourth edge 1E4. The first edge 1E1 and the second edge 1E2are arranged on opposite sides, and the third edge 1E3 and the fourthedge 1E4 are arranged on the opposite sides. The third edge 1E3 connectsone end of the first edge 1E1 and one end of the second edge 1E2. Andthe fourth edge 1E4 connects the other end of the first edge 1E1 and theother end of the second edge 1E2.

The first edge 1E1, the second edge 1E2, the third edge 1E3, or thefourth edge 1E4 may be straight, as illustrated, or may be curved,without being limited thereto.

The front F includes a first corner edge 1C1 to which the first edge 1E1and the third edge 1E3 are connected. The front F includes a secondcorner edge 1C2 to which the first edge 1E1 and the fourth edge 1E4 areconnected. The front F includes a third corner edge 1C3 to which thesecond edge 1E2 and the third edge 1E3 are connected. And the front Fincludes a fourth corner edge 1C4 to which the second edge 1E2 and thefourth edge 1E4 are connected.

The front F includes a center area 1A1 which approximately coincideswith the screen area of the display device. The center area 1A1 may beplanar or curved. And the center area 1A1 may be approximatelyquadrangular in shape, and may be transparent such that images on thescreen area of the display device are visible to the outside.

The front F includes an edge area 1A2 which surround the center area1A1. The edge area 1A2 may have an approximately quadrangular, annularshape. And the edge area 1A2 may exhibit a color. For example, the edgearea 1A2 may exhibit a color similar to or different from that of thebezel 3.

The front cover 1 includes a through-hole 1H1 for supporting a speakeror a receiver mounted on the electronic device 2000. Sound from thespeaker or the receiver is discharged to the outside via thethrough-hole 1H1.

The front cover 1 includes at least one transparent area 1T11 and 1T12for supporting an optical component (for example, a luminance sensor, animage sensor, etc.) mounted on the electronic device 2000. Externallight is introduced to the optical component via the transparent areas1T11 and 1T12.

The front cover 1 includes a through-hole 1H2 for supporting a buttonmounted on the electronic device 2000. The button is exposed to theoutside via the through-hole 1H2.

According to an embodiment of the present disclosure, the back Bincludes a first edge 2E1, a second edge 2E2, a third edge 2E3, and afourth edge 2E4. The first edge 2E1 and the second edge 2E2 are arrangedon opposite sides, and the third edge 2E3 and the fourth edge 2E4 arearranged on the opposite sides. The third edge 2E3 connects one end ofthe first edge 2E1 and one end of the second edge 2E2. And the fourthedge 2E4 connects the other end of the first edge 2E1 and the other endof the second edge 2E2.

The first edge 2E1, the second edge 2E2, the third edge 2E3, or thefourth edge 2E4 may be straight, as illustrated, or may be curved,without being limited thereto.

The back B includes a first corner edge 2C1 to which the first edge 2E1and the third edge 2E3 are connected. The back B includes a secondcorner edge 2C2 to which the first edge 2E1 and the fourth edge 2E4 areconnected. The back B includes a third corner edge 2C3 to which thesecond edge 2E2 and the third edge 2E3 are connected. And the back Bincludes a fourth corner edge 2C4 to which the second edge 2E2 and thefourth edge 2E4 are connected.

The back B includes a center area 2A1 and an edge area 2A2 whichsurround the center area 2A1. The center area 2A1 may be approximatelyquadrangular in shape, and includes a planar surface or a curvedsurface. And the edge area 2A2 may have an approximately quadrangular,annular shape. The edge area 2A2 includes a curved surface.

The back B may exhibit a color. For example, the back B may exhibit acolor similar to or different from that of the bezel 3.

The back cover 2 includes a through-hole 2H1 for a camera mounted on theelectronic device 2000. The camera is exposed to the outside via thethrough-hole 2H1. And the back cover 2 includes a through-hole or atransparent area 2H2 for a flash mounted on the electronic device 2000.Light from the flash is discharged to the outside via the through-holeor the transparent area 2H2.

The bezel 3 forms the side S of the electronic device 2000. For example,the side S includes a first connection surface S1 to which the firstedge 1E1 of the front F and the first edge 2E1 of the back B areconnected. The side S includes a second connection surface S2 to whichthe second edge 1E2 of the front F and the second edge 2E2 of the back Bare connected. The side S includes a third connection surface S3 towhich the third edge 1E3 of the front F and the third edge 2E3 of theback B are connected. And the side S includes a fourth connectionsurface S4 to which the fourth edge 1E4 of the front F and the fourthedge 2E4 of the back B are connected.

The bezel 3 includes a first connection surface SC1 to which the firstcorner edge 1C1 of the front F and the first corner edge 2C1 of the backB are connected. The bezel 3 includes a second connection surface S2 towhich the second corner edge 1C2 of the front F and the second corneredge 2C2 of the back B are connected. The bezel 3 includes a thirdconnection surface S3 to which the third corner edge 1C3 of the front Fand the third corner edge 2C3 of the back B are connected. And the bezel3 includes a fourth connection surface SC4 to which the fourth corneredge 1C4 of the front F and the fourth corner edge 2C4 of the back B areconnected.

At least a part of the side S of the bezel 3 includes a curved surface.

The bezel 3 includes a through-hole 3H1 for supporting an ear jackmounted on the electronic device 2000. An ear plug may be connected tothe ear jack via the through-hole 3H1. The through-hole 3H1 may bearranged on the first connection surface S1. Alternatively, an IR(Infrared Ray) sensor may be installed in place of the through-hole 3H1.

The bezel 3 includes a through-hole 3H21 for supporting a receptacle(for example, the receptacle 100 of FIG. 1) mounted on the electronicdevice 2000. A plug may be connected to the receptacle via thethrough-hole 3H21. The through-hole 3H21 may be arranged on the secondconnection surface S2.

The bezel 3 includes a through-hole 3H22 for supporting a microphonemounted on the electronic device 2000. Sound from the outside isintroduced to the microphone via the through-hole 3H22. The through-hole3H22 may be arranged on the second connection surface S2.

The bezel 3 includes a through-hole 3H23 for supporting a speakermounted on the electronic device 2000. Sound from the speaker isdischarged to the outside via the through-hole 3H23. The through-hole3H23 may be arranged on the second connection surface S2.

The bezel 3 includes a through-hole 3H24 for supporting a stylus, whichcan be attached to and detached from the electronic device 2000. Thestylus may be inserted into the inner space via the through-hole 3H24,or may be separated from the inner space via the through-hole 3H24. Thethrough-hole 3H24 may be arranged on the second connection surface S2.Alternatively, the through-hole 3H24 may be configured to support an earjack, and an ear plug may be connected to the ear jack via thethrough-hole 3H24.

The bezel 3 includes multiple through-holes 3H31 and 3H32 for supportingmultiple key buttons mounted on the electronic device 2000. The multiplekey buttons are exposed to the outside of the electronic device 2000 viathe multiple through-holes 3H31 and 3H32. The through-holes 3H31 and3H32 may be arranged on the third connection surface S3. Additionally, athrough-hole 3H41 for supporting a key button may be arranged on thefourth connection surface S4.

The bezel 3 includes a through-hole 3H42 for supporting a memory socketmounted on the electronic device 2000. A SIM card or a memory may beinserted into the memory socket via the through-hole 3H42. Thethrough-hole 3H42 may be arranged on the fourth connection surface S4.

The bezel 3 includes a through-hole 3HC2 for supporting an antennamounted on the electronic device 2000. The antenna may be inserted intothe inner space via the through-hole 3HC2, or may be withdrawn to theoutside via the through-hole 3HC2. The through-hole 3HC2 may be arrangedon the second connection surface SC2.

FIG. 22 is a sectional view of an electronic device, according to anembodiment of the present disclosure.

Referring to FIG. 22, an electronic device 2200 is provided. Aconfiguration regarding a part of the electronic device 2200 is providedherein, and the configuration may not be applied to the entireelectronic device 2200.

The electronic device 2200 includes a display device 103, a bracket 104,a circuit board 105, a device case 106, and a cover 107.

The display device 103 includes a window 1031, a display 1032, and adisplay circuit board 1033. The window 1031 may have a plate shape, maybe arranged on the display 1032, and may form a surface of theelectronic device 2200. The window 1031 includes plastic or glass havinga degree of resistance to shock. The window 1031 forms a transparentarea, which corresponds to the display surface 3001 (for example, thecenter area 1A1 of FIG. 21), and an opaque area, which corresponds tothe non-display surface 3002 (for example, the edge areas 1E1, 1E2, 1E3,and 1E4 of FIG. 21).

The display 1032 is arranged beneath the window 1031, and images on thedisplay 1032 are visible to the outside via the transparent area of thewindow 1031. The display 1032 has a plate shape.

The display circuit board 1033 is arranged beneath the display 1032, andcontrols output of images through the display 1032.

The display device 103 may further include a touch panel arrangedbetween the window 1031 and the display 1032. And the display device 103may further include a digitizer panel arranged between the display 1032and the display circuit board 1033. The touch panel or the digitizerpanel support touch input through the display surface 3001 of thedisplay device 103.

The bracket 104 is a portion on which the display device 103 and thecircuit board 105 are installed, and has a plate shape conforming to therectangular shape of the electronic device 2200. The bracket 104 is aportion on which electronic components can be installed, and support asurface 10451 and another surface 104S3, which face each other. Asillustrated in FIG. 22, the bracket 104 is structured such that it isarranged adjacent to the circuit board 105 of the display device 103, asurface 10451 of the bracket 104 is supported as a portion on which thedisplay device 103 can be installed, and another surface 104S3 of thebracket 104 is supported as a portion on which the circuit board 105 canbe installed. A surface 10451 and another surface 104S3 of the bracket104 have the shape of grooves, in which the display device 103 and thecircuit board 105 can be seated, and the display device 103 and thecircuit board 105 can therefore be mounted by being fitted to thebracket 104.

The bracket 104 provides the display device 103 and the circuit board105 with rigidity. And the bracket 104 may be used to shieldelectromagnetic waves or to block electric noise, or may be used as aheat-radiating plate for preventing heating of electronic components.The bracket 104 may be made of metal, such as magnesium (Mg) or aluminum(Al), or may be made of a non-metallic material, such as plastic,without being limited thereto. Additionally, a material for shieldingelectromagnetic waves may be applied to the bracket 104.

The circuit board 105 (also referred to as a main board, a mother board,or a Printed Board Assembly (PBA) configures multiple electroniccomponents 1055, which are mounted on a surface 10551 and/or anothersurface 105S3, and an electric circuit connecting them, and sets theexecution environment of the electronic device 2200, maintainsinformation regarding the same, and supports data input/output exchangebetween devices inside the electronic device 2200. The circuit board 105is arranged while being coupled to the bracket 104. The circuit board105 may be the circuit board 200 of FIG. 6A and FIG. 6B.

A surface 105S1 of the circuit board 105 abuts at least a part ofanother surface 104S3 of the bracket 104, and the other surface 104S3 ofthe bracket 104 provides a space capable of containing electroniccomponents installed on the surface 10551 of the circuit board 105. Aspace may be provided between the other surface 105S3 of the circuitboard 105 and the device case 106, and electronic components 1055installed on the other surface 105S3 of the circuit board 105 may becontained in the space.

The device case 106 (bezel 3 of FIG. 20 and FIG. 21) has the shape of acontainer having an upward opening, and is coupled to the bracket 104,thereby forming the overall framework of the electronic device 2200.Electronic components (for example, a display device 103 and a circuitboard 105) re mounted on a frame structure, which includes the devicecase 106 and the bracket 104, and exists inside the electronic device2200. The device case 106 includes a first portion 106-1, which formsstill another surface 100S2 of the electronic device 2200, and a secondportion 106-2, which extends from the first case 106-1 and is arrangedbeneath the bracket 104. The first portion 106-1 is shaped to engagewith the bracket 104 such that, as illustrated in FIG. 22, theperipheral portion of the bracket 104 can be fitted to the inside shapeof the first portion 106-1, and the bracket 104 can be mounted on thedevice case 106 without playing. The second portion 106-2 is shaped tocover a surface 104S3 of the bracket 104, and the inside surface 106-2S1of the second portion 106-2 may be smooth as illustrated in FIG. 22, butmay have various corrugated shapes without being limited thereto. Forexample, the inside surface 106-2S1 of the second portion 106-2 may haveat least one rib extending to the bracket 104, and the rib may play therole of supporting the bracket 104. In addition, the inside surface106-2S 1 of the second portion 106-2 may have at least one rib extendingto the circuit board 105, and the rib may play the role of supportingthe circuit board 105.

The second portion 106-2 may have a through-hole, and some (for example,a memory socket) of the electronic components 1055 of the circuit board105 may be inserted into the through-hole of the second portion 106-2.When the cover 107 covers the second portion 106-2 of the device case106, the electronic component of the circuit board 105, which isarranged in the through-hole of the second portion 106-2, is notvisible. On the other hand, when the cover 107 is separated from thedevice case 106, the electronic component of the circuit board 105,which is arranged in the through-hole of the second portion 106-2, isexposed.

The device case 106 may include a conductive material, and may also beconfigured to be electrically connected to the ground surface of thecircuit board 105. For example, a conductive material may be applied tothe inside surface 106-2S1 of the second portion 106-2 of the devicecase 106. The electric connection between the conductive material of thedevice case 106 and the ground surface of the circuit board 105 may becaused by making the rib of the second portion 106-2 contact the groundsurface of the circuit board 105. In this configuration, the rib of thesecond portion 106-2 includes a conductive rubber gasket for making anelastic contact with the ground surface of the circuit board 105.

The cover 107 can be coupled to the second portion 106-2 of the devicecase 106, and forms a surface 100S3 of the electronic device 2200. Thecover 107 may be curved, and a surface 100S3 of the electronic device2200 may be formed as a curved surface. The second portion 106-2 of thedevice case 106 has the shape of a groove on which the cover 107 can beseated, and the cover 107 can therefore be mounted by being fitted tothe second portion 106-2 of the device case 106. And the cover 107 canbe coupled to the second portion 106-2 of the device case 106 through asnap-fit, and the cover 107 can be separated from the second portion106-2 of the device case 106. In order to attach/detach an electroniccomponent (for example, a memory card or a battery pack), the cover 107can be separated from the device case 106.

FIG. 23 illustrates an electronic device in a disassembled state,according to an embodiment of the present disclosure.

Referring to FIG. 23, the electronic device 2200 includes a displaydevice 103, a bracket 104, a circuit board 105, a device case 106, and abattery pack 109 and a cover 107.

The display device 103 is approximately rectangular. The display device103 includes a display area 3001 and a non-display area 3002. Thedisplay area 3001 (for example, the center area 1A1 of FIG. 21)corresponds to the screen of the display 1032 (FIG. 22). The displayarea 3001 has the shape of a rectangle elongated in the y-axisdirection. The non-display area 3002 (for example, the edge areas 1E1,1E2, 1E3, and 1E4 of FIG. 21) has a quadrangular, annular areasurrounding the display area 3001. For example, as illustrated in FIG.23, the non-display area 3002 includes an upper peripheral area 3002-U(for example, the edge area 1E1 of FIG. 21), a lower peripheral area3002-D (for example, the edge area 1E2 of FIG. 21), a left peripheralarea 3002-L (for example, the edge area 1E3), and a right peripheralarea 3002-R (for example, the edge area 1E4 of FIG. 21). The upperperipheral area 3002-U and the lower peripheral area 3002-D are arrangedto face each other. And the left peripheral area 3002-L and the rightperipheral area 3002-R are arranged to face each other. The upperperipheral area 3002-U and the lower peripheral area 3002-D may have awidth larger than that of the left peripheral area 3002-L or the rightperipheral area 3002-R. The non-display area 3002 may be provided in thecolor black. Alternatively, the non-display area 302 may be a metallictexture.

The display device 103 includes a receiver hole 3002-1 arranged in thenon-display area 3002 (for example, the upper peripheral area 3002-U).The receiver 3002-1 is positioned to correspond to a receiver, which isinstalled on the circuit board 105 or the device case 106, and soundoutput from the receiver is discharged to the outside via the receiverhole 3002-1.

The display device 103 includes a button hole 3002-2 arranged in thenon-display area 3002 (for example, the lower peripheral area 3002-D).The display device 103 includes a button circuit arranged between thewindow 1031 (FIG. 22) and the bracket 104. The button 3002-21 of thebutton circuit is arranged on a surface of the electronic device 2200via the button hole 3002-2.

The display device 103 further includes a transparent area 3002-3arranged in the non-display area 3002. The transparent area 3002-3 isarranged to correspond to a sensor (for example, a luminance sensor oran image sensor) installed on the circuit board 105.

The display device 103 further includes a touch key marker 3002-4arranged in the non-display area 3002. The touch key marker 3002-4 maybe arranged on both sides of the button hole 3002-2. The display device103 includes a touch key circuit arranged between the window 1031 andthe bracket 104. The touch key circuit is arranged to correspond to thetouch key marker 3002-4.

The display device 103 includes a connector (for example, a headerconnector), which is not shown. The connector is used to electricallyconnect between a display 1032 (as shown in FIG. 22) installed on thedisplay device 103 and/or a touch input device (for example, a touchpanel or a digitizer panel) and the circuit board 105. Alternatively,the connector may be used to electrically connect between a buttoncircuit installed on the display device 103 or a touch key circuit andthe circuit board 105.

The circuit board 105 is arranged between the bracket 104 and the devicecase 106. The circuit board 105 includes multiple separable circuitboards 105-1 and 105-2. For example, the circuit board 105 includes afirst circuit board 105-1 and a second circuit board 105-2, which arearranged on both sides of the electronic device 2200, respectively. Thefirst circuit board 105-1 includes a first connector 105-1C shaped toprotrude relative to other parts. And the second circuit board 105-2includes a second connector 105-2C shaped to protrude relative to otherparts. The first connector 105-1C and the second connector 105-2C areconnected, and the first circuit board 105-1 and the second circuitboard 105-2 are electrically connected.

The receptacle 100 is installed on the circuit board 105 (for example,the second circuit board 105-2). The device case 106 includes athrough-hole 3H21 for supporting the receptacle 100 mounted on thecircuit board 105. A plug may be connected to the receptacle via thethrough-hole 3H21.

The circuit board 105 includes multiple bolt holes 105-1H, 105-2H,105-3H, 105-4H, 105-5H, 105-6H, 105-7H, and 105-8H. The multiple boltholes 105-1H, 105-2H, 105-3H, 105-4H, 105-5H, 105-6H, 105-7H, and 105-8Hare arranged to correspond to multiple bosses of the bracket 104.

Multiple bolts B1, B2, B4, and B6 penetrate the multiple bolt holes105-1H, 105-2H, 105-3H, 105-4H, 105-5H, and 105-6H of the circuit board105 and are fastened to multiple bosses of the bracket 104, and, as aresult, the circuit board 105 and the bracket 104 can be coupledtogether.

The device case 106 includes multiple bolt holes 106-7H and 106-8H. Themultiple bolt holes 106-7H and 106-8H are arranged to correspond tomultiple bolt holes 105-7H and 105-8H of the circuit board 105. Multiplebolts B7 and B8 penetrate the multiple bolt holes 106-7H and 106-8H ofthe device case 106 and the multiple bolt holes 105-7H and 105-8H of thecircuit board 105 and are fastened to multiple bosses of the bracket104, and, as a result, the device case 106, the circuit board 105, andthe bracket 104 are coupled together. The display device 103 is finallycoupled to the bracket 104 after the device case 106, the circuit board105, and the bracket 104 are coupled.

The device case 106 includes an open portion 620 on which the bracket104 is installed. The circuit board 105 is arranged in a space formed bycoupling between the device case 106 and the bracket 104.

The device case 106 may include a conductive material, which reduceselectric noise of the electronic device 2200 or diffuses heat from aheat-generating component (for example, the circuit board 105).

The device case 106 includes a transparent window 616. For example, thetransparent window 616 is arranged to correspond to an opticalelectronic component (for example, a camera module) arranged on asurface 105S3 (as shown in FIG. 22) of the circuit board 105.

The battery pack 109 is arranged on a battery pack installation portionformed on a surface 106-2S3 (FIG. 22) of the device case 106.

The cover 107 is arranged beneath the device case 106. The cover 107includes a through-hole 716 and multiple hooks 717. The through-hole 716is arranged to correspond to the transparent window 616 of the devicecase 106. The multiple hooks 717 are arranged on a periphery 107-R. Themultiple hooks 717 are fastened to multiple hook fastening grooves, andthe cover 107 is coupled to the device case 106.

The cover 107 may include a conductive material. The conductive materialreduces the electric noise of the electronic device 2200. Alternatively,the conductive material diffuses heat from a heat-generating component(for example, the circuit board 105).

The electronic device 2200 may further include a circuit deviceincluding an antenna or a speaker, which is arranged between the secondcircuit board 105-2 and the device case 106. For example, a terminal(for example, an elastic terminal) of the circuit device mayelectrically contact a terminal arranged on a surface of the secondcircuit board 105-2. The circuit device may be shaped such that anantenna or a speaker is arranged on an injection molded object.

FIG. 24A illustrates a receptacle and a circuit board, according to anembodiment of the present disclosure.

Referring to FIG. 24A, the receptacle 100 is installed on the circuitboard 105 in a mid-mount installation structure or a top mountinstallation structure.

The circuit board 105 includes a conductive pattern 2400 used as anantenna. The conductive pattern 2400 forms a transmission line forreceiving a current from the circuit board 105 and emitting radio waves.The shape of the conductive pattern 2400 may be implemented variouslyaccording to the communication used by the electronic device 1000.

The antenna of the electronic device 1000 is arranged on a non-conducivestructure (for example, a carrier) mounted on the circuit board 105.

The conductive pattern 2400 is arranged in an area of the circuit board105 near the receptacle 100. For example, the receptacle 100 ispositioned near an edge of the electronic device 1000 to enableinsertion of a plug of an external device (for example, a charger), andthe receptacle 100 is arranged near an edge 105-E of the circuit board105. In addition, the conductive pattern 2400 is arranged near an edgeof the electronic device 100 in order to improve the antenna performanceor reduce the Specific Absorption Rate (SAR). To this end, theconductive pattern 2400 is arranged near an edge 105-E of the circuitboard 105. Therefore, a predetermined area of the circuit board 105 isdivided into an area in which the receptacle 100 is installed andanother area in which the conductive pattern 2400 is installed.

The receptacle 100 of an embodiment of the present invention has a sizesmaller than that of a receptacle 1100 (as shown in FIG. 7A) of theprior art, thereby securing a larger area on the circuit board 105, inwhich the conductive pattern 2400 is to be installed. Therefore, theconductive pattern 2400 can be installed using the secured area, whichleads to improvement of the antenna performance.

Additionally, the conductive pattern 2400 is arranged so as not tooverlap the receptacle 100. In this configuration, the receptacle 100has a size smaller than that of a receptacle 1100 of the prior art,thereby securing a larger area on the circuit board 105, in which theconductive pattern 2400 is to be installed; this makes it possible tosecure an area, in which the conductive pattern 2400 is to be installed,without being influenced by the area of installation of the receptacle100, helping to improve the antenna performance.

It is also possible to design circuit board 105 and receptacle 100configuration such that radio waves can be emitted using an empty areaor slot 2400S, which is formed by the conductive pattern 2400. In thisconfiguration, the receptacle 100 has a size smaller than that of areceptacle 1100 of the prior art, thereby securing a larger area on thecircuit board 105, in which the conductive pattern 2400 is to beinstalled; this makes it easy to form the slot 2400S and to help improvethe antenna performance.

FIG. 24B is a diagram comparing an antenna installation area inconnection with a circuit board, according to the prior art, and anantenna installation area in connection with a circuit board, accordingto an embodiment of the present disclosure.

Referring to FIG. 24B, a circuit board 1200 according to the prior artand a circuit board 105 according to an embodiment of the presentinvention is provided. It will be assumed in this configuration, thatthe circuit board 1200 and the circuit board 105 have an approximatelyidentical component installation area.

The antenna installation area 1200-A of the circuit board 1200, whichcorresponds to the component installation area excluding the area inwhich the receptacle 1100 is installed, may be smaller than the antennainstallation area 100-A of the circuit board 105, which corresponds tothe component installation area excluding the area in which thereceptacle 100 is installed. This is because the receptacle 100 of anembodiment of the present disclosure has a size smaller than that of thereceptacle 1100 of the prior art. For example, with regard to the plugentry/exit direction (IN-OUT), the width W1 that is not occupied by thereceptacle 100 between opposite edges 105-E and 105-E1 of the circuitboard 105 is larger than the width W2 that is not occupied by thereceptacle 100 between opposite edges 1200-E and 1200-E1 of the circuitboard 1200. Therefore, the structure of coupling between the circuitboard 105 and the receptacle 100 provides a larger area, in which anantenna (for example, a conductive pattern 2400 of FIG. 6A) can beinstalled, with regard to the plug entry/exit direction IN-OUT ascompared with the structure of coupling between the circuit board 1200and the receptacle 1100.

The structure of coupling between the circuit board 105 and thereceptacle 100 provides a larger area, in which an antenna (for example,a conductive pattern 2400 of FIG. 6A) can be installed, with regard to adirection perpendicular to the plug entry/exit direction IN-OUT ascompared with the structure of coupling between the circuit board 1200and the receptacle 1100.

FIG. 25 is a block diagram of an electronic device, according to variousembodiments.

Referring to FIG. 25, an electronic device 2500 is provided. Theelectronic device 2500 includes at least one application processor (AP)2510, a communication module 2520, a subscriber identification module(SIM) card 2524, a memory 2530, a sensor module 2540, an input unit2550, a display 2560, an interface 2570, an audio module 2580, a cameramodule 2591, a power management module 2595, a battery 2596, anindicator 2597, and a motor 2598.

The processor 2510 controls a plurality of hardware or softwarecomponents connected to the processor 2510 by driving an operatingsystem or an application program and performs processing of variouspieces of data and calculations. The processor 2510 may be implementedby, for example, a System on Chip (SoC). The processor 2510 may furtherinclude a GPU (graphic processing unit) and/or an image signalprocessor. The processor 2510 may include at least some (e.g., acellular module 2521) of the elements illustrated in FIG. 25. Theprocessor 2510 loads, into a volatile memory, instructions or datareceived from at least one (e.g., a non-volatile memory) of the otherelements and processes the loaded instructions or data, and storesvarious data in a non-volatile memory.

The communication module 2520 includes, for example, a cellular module2521, a Wi-Fi module 2523, a Bluetooth (BT) module 2525, a GlobalNavigation Satellite System (GNSS) module 2527 (for example, a GPSmodule, a Glonass module, a Beidou module, or a Galileo module), an NearField Communication (NFC) module 2528, and a Radio Frequency (RF) module2529.

The cellular module 2521 provides a voice call, image call, a textmessage service, or an Internet service through a communication network.The cellular module 2521 performs recognition and authentication of anelectronic device 2501 within a communication network using the SIM card2524. The cellular module 2521 may perform at least a part of thefunctions which can be provided by the processor 2510. The cellularmodule 2521 may include a Communication Processor (CP).

Each of the Wi-Fi module 2523, the BT module 2525, the GNSS module 2527,and the NFC module 2528 may include, for example, a processor forprocessing data transmitted and received through the relevant module. Atleast some of the cellular module 2521, the WIFI module 2523, the BTmodule 2525, the GPS module 2527, and the NFC module 2528 may beincluded in one Integrated Chip (IC) or IC package.

The RF module 2529 transmits/receives a communication signal (forexample, an RF signal). The RF module 2529 may include, for example, atransceiver, a Power Amp Module (PAM), a frequency filter, a Low NoiseAmplifier (LNA), or an antenna. Alternatively, at least one of thecellular module 2521, the Wi-Fi module 2523, the BT module 2525, the GPSmodule 2527, and the NFC module 2528 may transmit/receive an RF signalthrough a separate RF module.

The SIM card 2524 is a card inserted into a slot of the electronicdevice 2500. The SIM card 2524 contains unique identificationinformation (e.g., an Integrated Circuit Card Identifier (ICCID)) orsubscriber information (e.g., an International Mobile SubscriberIdentity (IMSI)).

The memory 2530 includes an internal memory 2532 or an external memory2534. The internal memory 2532 includes for example, a volatile memory(for example, a Dynamic Random Access Memory (DRAM), a Static RAM(SRAM), a Synchronous Dynamic RAM (SDRAM), and the like) and anon-volatile memory (for example, a One Time Programmable Read OnlyMemory (OTPROM), a Programmable ROM (PROM), an Erasable and ProgrammableROM (EPROM), an Electrically Erasable and Programmable ROM (EEPROM), aflash memory (for example, a NAND flash memory or a NOR flash memory), ahard driver, or a Solid State Drive (SSD).

The external memory 2534 includes, for example, a flash drive, forexample, a Compact Flash (CF), a Secure Digital (SD), a Micro SecureDigital (Micro-SD), a Mini Secure Digital (Mini-SD), an eXtreme Digital(xD), a memory stick, or the like. The external memory 2534 may befunctionally and/or physically connected to the electronic device 2500through various interfaces.

The sensor module 2540 measures a physical quantity or detects anoperation state of the electronic device 2500, and converts the measuredor detected information into an electrical signal. The sensor module2540 may include, for example, at least one of a gesture sensor 2540A, agyro sensor 2540B, an atmospheric pressure sensor 2540C, a magneticsensor 2540D, an acceleration sensor 2540E, a grip sensor 2540F, aproximity sensor 2540G, a color (for example, a red, green, blue (RGB))sensor 2540H, a biometric sensor 2540I, a temperature/humidity sensor2540J, a luminance sensor 2540K, and a ultraviolet (UV) sensor 2540M.Additionally or alternatively, the sensor module 2540 may include anE-nose sensor, an electromyography (EMG) sensor, an electroencephalogram(EEG) sensor, an electrocardiogram (ECG) sensor, an infrared (IR)sensor, an iris sensor, and/or a fingerprint sensor. The sensor module2540 may further include a control circuit for controlling one or moresensors included therein. The electronic apparatus 2500 may furtherinclude a processor configured to control the sensor module 2540 as apart of or separately from the processor 2510, and may control thesensor module 2540 while the processor 2510 is in a sleep state.

The input device 2550 includes, for example, a touch panel 2552, a(digital) pen sensor 2554, a key 2556, or an ultrasonic input device2558. The touch panel 2552 may use for example, a capacitive type, aresistive type, an infrared type, and an ultrasonic type. Also, thetouch panel 2552 may further include a control circuit. The touch panel2552 may further include a tactile layer and provide a tactile reactionto the user.

The (digital) pen sensor 2554 may include, for example, a recognitionsheet which is a part of the touch panel or is separated from the touchpanel.

The key 2556 may include, for example, a physical button, an optical keyor a keypad.

The ultrasonic input device 2558 detects ultrasonic wavers generated byan input tool through a microphone 2588 and identifies datacorresponding to the detected ultrasonic waves.

The display 2560 may include a panel 2562, a hologram device 2564, or aprojector 2566.

The panel 2562 may be implemented to be, for example, flexible,transparent, or wearable. The panel 2562 and the touch panel 2552 may beimplemented as one module.

The hologram device 2564 displays a three dimensional image in the airby using an interference of light.

The projector 2566 displays an image by projecting light onto a screen.The screen may be located inside or outside the electronic apparatus2500.

The display 2560 may further include a control circuit for controllingthe panel 2562, the hologram device 2564, or the projector 2566.

The interface 2570 may include, for example, a High-DefinitionMultimedia Interface (HDMI) 2572, a Universal Serial Bus (USB) 2574, anoptical interface 2576, or a D-subminiature (D-sub) 2578. Additionallyor alternatively, the interface 2570 may include, for example, a MobileHigh-definition Link (MHL) interface, a Secure Digital (SD)card/Multi-Media Card (MMC) interface, or an Infrared Data Association(IrDA) standard interface.

The interface 2570 may include a C-type receptacle 100 for a USBcommunication interface installed on the circuit board 200 (as shown inFIG. 6A and FIG. 6B).

The audio module 2580 bilaterally converts a sound and an electricalsignal. The audio module 2580 processes sound information which is inputor output through, for example, a speaker 2582, a receiver 2584,earphones 2586, and the microphone 2588.

The camera module 2591 is a device capable of taking still and movingimages and includes one or more image sensors (for example, a frontsensor or a back sensor), a lens, an Image Signal Processor (ISP), or aflash (for example, LED or xenon lamp).

The power management module 2595 manages power of the electronic device2500. The power management module 2595 includes a PMIC (power managementintegrated circuit), a charger IC (charger integrated circuit), or abattery gauge.

The PMIC may use a wired and/or wireless charging method. Examples ofthe wireless charging method includes, for example, a magnetic resonancemethod, a magnetic induction method, an electromagnetic method, etc.Additional circuits (e.g., a coil loop, a resonance circuit, arectifier, etc.) for wireless charging may be further included.

The battery gauge measures, for example, a residual quantity, a voltage,a current, or a temperature of the battery 2596 during charging. Thebattery 2596 includes, for example, a rechargeable battery or a solarbattery.

The indicator 2597 displays a particular state (e.g., a booting state, amessage state, a charging state, or the like) of the electronic device2500 or a part (e.g., the processor 2510) thereof.

The motor 2598 converts an electrical signal into mechanical vibration,and generates a vibration, a haptic effect, etc.

The electronic apparatus 2501 may include a processing unit (e.g., aGPU) for supporting a mobile television (TV). The processing unit forsupporting mobile TV processes media data according to a certainstandard, such as Digital Multimedia Broadcasting (DMB), Digital VideoBroadcasting (DVB), or mediaFLO™.

An electronic device may include a circuit board including multiplelands arranged on a surface; and an electrical receptacle includingmultiple contacts electrically connected to the multiple lands, theelectrical receptacle being installed on the circuit board. In thisconfiguration, at least one (for example, at least two) contacts areconnected to at least one land among the multiple lands.

The multiple lands may be arranged in one row. The multiple lands mayhave a constant width or an inconstant width. The multiple lands may bearranged at a constant interval or at an inconstant interval. Themultiple lands may be arranged in a direction perpendicular to adirection of inserting a plug into the receptacle. The number of themultiple lands may be smaller than the number of the multiple contacts.

The receptacle may include a conductive receptacle shell comprising apassage, into which a plug can be inserted, and a receptacle tonguecomprising a free end portion having a shape of a plate arranged insidethe passage of the receptacle shell. And the multiple contacts mayinclude multiple first sections arranged on opposite surfaces of thefree end portion of the receptacle tongue to be electrically connectedto the plug; and multiple second sections extending from the multiplefirst sections and having tails coupled to the multiple lands usingsoldering.

At least two of the tails of the multiple second sections may be coupledtogether to one land among the multiple lands.

At least two tails coupled together to one land among the multiple landsmay include both a tail extending from at least one first sectionarranged on a first surface of the free end portion of the receptacletongue, among the multiple first sections, and a tail extending from atleast one first section arranged on a second surface of the free endportion of the receptacle tongue, among the multiple first sections.

Tails of the at least two second sections coupled together to one landamong the multiple lands may be stacked and arranged on the one land ina vertical direction.

Tails of the at least two second sections coupled together to one landamong the multiple lands may be arranged on the one land in a horizontaldirection.

A space for solder rising may be formed between tails of the at leasttwo second sections coupled together to one land among the multiplelands.

The number of multiple first sections arranged on the first surface ofthe free end portion of the receptacle tongue and the number of multiplefirst sections arranged on the second surface of the free end portion ofthe receptacle tongue may be identical.

The circuit board includes multiple component holes electricallyconnected to a ground. In addition, the receptacle may include multipleleads extending from the conductive receptacle shell. Furthermore, thereceptacle may be coupled to the circuit board by inserting the multipleleads into the multiple component holes and then performing soldering.In addition, the conducive receptacle shell may be used as a groundreturn path of the circuit board.

The multiple lands may be arranged between a pair of component holesamong the multiple component holes.

The receptacle tongue include a conductive mid-plate arranged inside thefree end portion of the receptacle tongue. And the conductive mid-platemay include at least one extension portion electrically connected tomultiple leads of the receptacle shell or to the multiple componentholes, and may be used as a ground return path of the circuit board.

The electronic device may further include at least one additionalconductive contact arranged on the free end portion of the receptacletongue to be electrically connected to the plug. And the additionalconductive contact may be electrically connected to the conductivemid-plate.

The at least one additional conductive contact may be arranged on thefirst surface or the second surface of the free end portion of thereceptacle tongue, and may be arranged closer to the outer side than themultiple first sections.

The electronic device may further include a conductive pattern installedon the circuit board and used as an antenna. And the conductive patternmay not overlap with the receptacle.

The receptacle may include a reversible connector.

The receptacle supports at least one communication specification.

The at least one communication specification includes at least one ofUSB 3.x and USB 2.x.

An electronic device includes a circuit board including multiple landsarranged on a surface in one row; and an electrical receptacle includingmultiple contacts electrically connected to the multiple lands, theelectrical receptacle being installed on the circuit board. Thereceptacle, compared with a predetermined receptacle supporting multiplecommunication specifications, may solely include the multiple contactscorresponding to the only one communication specification supported bythe electronic device.

At least two contacts may be connected to one land among the multiplelands.

The number of the multiple lands may be smaller than the number of themultiple contacts.

The electronic device may support a communication specification of arelatively lower version among multiple communication specifications.

A predetermined receptacle, which supports multiple communicationspecifications, may support a USB 3.x communication specification and aUSB 2.x communication specification.

The electronic device may support only the USB 2.x communicationspecification.

The receptacle includes a C-type connector or a reversible connector.

An electronic device may include a circuit board including multiplelands arranged on a surface in one row; and an electrical receptacleincluding multiple contacts electrically connected to the multiplelands, the electrical receptacle being installed on the circuit board.The receptacle, compared with a universal receptacle supporting both acommunication specification of an upper version and a communicationspecification of a lower version, may include only the multiple contactscorresponding to the communication specification of the lower versionsupported by the electronic device.

At least two contacts are connected to one land among the multiplelands.

The number of the multiple lands may be smaller than the number of themultiple contacts.

The communication specification of the upper version may be USB 3.x, andthe communication specification of the lower version may be USB 2.x.

The receptacle includes a C-type connector or a reversible connector.

Each of the above-described component elements of hardware according tothe present disclosure may be configured with one or more components,and the names of the corresponding component elements may vary based onthe type of electronic device. In various embodiments, the electronicdevice may include at least one of the above-described elements. Some ofthe above-described elements may be omitted from the electronic device,or the electronic device may further include additional elements. Also,some of the hardware components according to various embodiments may becombined into one entity, which may perform functions identical to thoseof the relevant components before the combination.

Various embodiments of the present disclosure disclosed in thisspecification and the drawings are merely specific examples presented inorder to easily describe technical details of the present disclosure andto help the understanding of the present disclosure, and are notintended to limit the scope of the present disclosure. Therefore, itshould be understood that, in addition to the embodiments disclosedherein, all modifications and changes or modified and changed formsderived from the technical idea of various embodiments of the presentdisclosure fall within the scope of the present disclosure as set forthby the following claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a circuit boardcomprising multiple lands arranged on a surface; and an electricalreceptacle comprising multiple contacts electrically connected to themultiple lands, the electrical receptacle being installed on the circuitboard, wherein the receptacle comprises: a tongue disposed in a shell ofthe receptacle; multiple first sections of the multiple contactsarranged on opposite surfaces of the tongue to be electrically connectedto a plug when the plug is inserted into the shell; and multiple secondsections of the multiple contacts extending from the multiple firstsections and having tails coupled to the multiple lands using solder,wherein at least two tails of the multiple second sections are stackedon one land among the multiple lands.
 2. The electronic device of claim1, wherein the multiple lands have a constant width or a variable width,or are arranged at a constant interval or at a variable interval.
 3. Theelectronic device of claim 1, wherein a number of the multiple lands issmaller than a number of the multiple contacts.
 4. The electronic deviceof claim 1, further comprising a conductive pattern installed on thecircuit board and used as an antenna, the conductive pattern notoverlapping with the receptacle.
 5. The electronic device of claim 1,wherein the at least two tails of the multiple second sections coupledto the one land among the multiple lands comprise both a tail extendingfrom at least one first section, arranged on a first surface of of thetongue, among the multiple first sections, and a tail extending from atleast one first section, arranged on a second the tongue, among themultiple first sections.
 6. The electronic device of claim 1, whereinanother two or more tails of the multiple second sections are stacked onanother one land among the multiple lands side by side.
 7. Theelectronic device of claim 1, wherein the multiple first sections aredivided into two groups of a same number on the opposite surfaces of thetongue.
 8. The electronic device of claim 1, wherein the receptacle is areceptacle for Universal Serial Bus (USB) 3.x protocol.
 9. Theelectronic device of claim 1, wherein the receptacle comprises a C-typeconnector or a reversible connector.
 10. The electronic device of claim1, wherein the shell is electrically conductive.
 11. The electronicdevice of claim 10, wherein the circuit board comprises multiplecomponent holes electrically connected to a ground, the receptaclecomprises multiple leads extending from the shell, the receptacle iscoupled to the circuit board by inserting the multiple leads into themultiple component holes and then performing soldering, and the shell isused as a ground return path of the circuit board.
 12. The electronicdevice of claim 11, wherein the multiple lands are arranged between apair of component holes among the multiple component holes.
 13. Theelectronic device of claim 11, wherein the tongue comprises a conductivemid-plate arranged inside a free end portion of the tongue, and whereinthe conductive mid-plate comprises at least one extension portionelectrically connected to multiple leads of the shell or to the multiplecomponent holes, and is used as a ground return path of the circuitboard.
 14. The electronic device of claim 13, further comprising atleast one additional conductive contact arranged on the free end portionof the tongue to be electrically connected to the plug, the at least oneadditional conductive contact being electrically connected to theconductive mid-plate.
 15. The electronic device of claim 1, wherein themultiple lands are arranged in a single row.
 16. The electronic deviceof claim 15, wherein the multiple lands are arranged in a directionperpendicular to a direction of inserting the plug into the receptacle.17. An electronic device comprising: a circuit board comprising multiplelands arranged on a surface; and an electrical receptacle comprisingmultiple contacts electrically connected to the multiple lands, theelectrical receptacle being installed on the circuit board, wherein themultiple lands are arranged in a single row, and wherein the receptaclecomprises: a tongue disposed in a shell of the receptacle; multiplefirst sections of the multiple contacts arranged on opposite surfaces ofthe tongue to be electrically connected to a plug when the plug isinserted into the shell; and multiple second sections of the multiplecontacts extending from the multiple first sections and having tailscoupled to the multiple lands using solder, wherein at least two tailsof the multiple second sections are coupled to one land among themultiple lands, and wherein the at least two tails of the multiplesecond sections are bent in opposing directions.
 18. An electronicdevice comprising: a circuit board comprising multiple lands arranged ona surface; and an electrical receptacle comprising multiple contactselectrically connected to the multiple lands, the electrical receptaclebeing installed on the circuit board, wherein the receptacle comprises:a tongue disposed in a shell of the receptacle; multiple first sectionsof the multiple contacts arranged on opposite surfaces of the tongue tobe electrically connected to a plug when the plug is inserted into theshell; and multiple second sections of the multiple contacts extendingfrom the multiple first sections and having tails coupled to themultiple lands using solder, wherein at least two tails of the multiplesecond sections are coupled to one land among the multiple lands side byside, and wherein a portion of the solder is disposed between the atleast two tails.